blob: 4e2e66e466a52a2049e99bcb902b27f434063640 (
plain)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
|
(footprint "ST_WLCSP-64_Die462" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 5AE11EAD)
(descr "WLCSP-64, 8x8 raster, 3.357x3.657mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00340475.pdf")
(tags "BGA 64 0.4")
(attr smd)
(fp_text reference "REF**" (at 0 -2.8285) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp d53ae5c7-cf16-48b1-9733-03f2d1991a49)
)
(fp_text value "ST_WLCSP-64_Die462" (at 0 2.8285) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp db664211-4ec9-4945-9ee1-18acfa571a6f)
)
(fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
(effects (font (size 0.78 0.78) (thickness 0.117)))
(tstamp 45289c01-9893-4e97-8d4c-ee6624a8e1dc)
)
(fp_line (start -1.8035 1.9535) (end -1.8035 -1.11425) (layer "F.SilkS") (width 0.12) (tstamp 1170f239-e109-4510-80d1-33601782c303))
(fp_line (start -0.96425 -1.9535) (end 1.8035 -1.9535) (layer "F.SilkS") (width 0.12) (tstamp 2a9cffd9-d474-4274-8654-67ec4b6c6612))
(fp_line (start 1.8035 -1.9535) (end 1.8035 1.9535) (layer "F.SilkS") (width 0.12) (tstamp 377ecdc6-8fd2-4eb4-8dcb-a38462b6ce6a))
(fp_line (start 1.8035 1.9535) (end -1.8035 1.9535) (layer "F.SilkS") (width 0.12) (tstamp f2c73e58-461e-408d-bea3-c1b2d0a805ef))
(fp_line (start 2.68 2.83) (end 2.68 -2.83) (layer "F.CrtYd") (width 0.05) (tstamp 226dcb40-c5d4-4d7a-ad3e-f4a2bf0c5842))
(fp_line (start 2.68 -2.83) (end -2.68 -2.83) (layer "F.CrtYd") (width 0.05) (tstamp 516d9ada-9b5b-484f-ab28-07d900069a37))
(fp_line (start -2.68 -2.83) (end -2.68 2.83) (layer "F.CrtYd") (width 0.05) (tstamp 95fa5702-a781-4785-a010-f84a93a3cf5f))
(fp_line (start -2.68 2.83) (end 2.68 2.83) (layer "F.CrtYd") (width 0.05) (tstamp c3ccfade-20f5-4403-81d2-0759b22a3229))
(fp_line (start 1.6785 1.8285) (end -1.6785 1.8285) (layer "F.Fab") (width 0.1) (tstamp 620a715b-31ab-4fec-af55-0d17fb0533a9))
(fp_line (start -1.6785 -0.98925) (end -0.83925 -1.8285) (layer "F.Fab") (width 0.1) (tstamp 8da40658-b1ad-4e42-8c23-324fcc61b086))
(fp_line (start -1.6785 1.8285) (end -1.6785 -0.98925) (layer "F.Fab") (width 0.1) (tstamp b04aa7f1-803e-4e04-9a70-d586ad11c853))
(fp_line (start 1.6785 -1.8285) (end 1.6785 1.8285) (layer "F.Fab") (width 0.1) (tstamp b14dd828-df6e-4990-a92c-ecff8b53b8e4))
(fp_line (start -0.83925 -1.8285) (end 1.6785 -1.8285) (layer "F.Fab") (width 0.1) (tstamp bc7bf03d-18ec-4fc8-a311-7a545ee59b5b))
(pad "A1" smd circle (at -1.4 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 9f22f16f-5e2a-4bcb-9349-cbd6b38cff32))
(pad "A2" smd circle (at -1 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 7f9ddfa7-86d2-42df-bd5d-d78e9802f4d9))
(pad "A3" smd circle (at -0.6 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 50e474b3-425f-4a70-bd40-2fd6edf928a8))
(pad "A4" smd circle (at -0.2 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 8658981f-85d3-4561-bc5d-b3b87dabeeae))
(pad "A5" smd circle (at 0.2 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 816dd0cb-568b-488b-a70e-3a4cb4c5e766))
(pad "A6" smd circle (at 0.6 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 9d4c03e5-9223-404c-b130-54866b9dd843))
(pad "A7" smd circle (at 1 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp f9e9008e-4bf1-4fce-9abd-462107caa92d))
(pad "A8" smd circle (at 1.4 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 0955479b-c328-41c3-a397-6bb03787a4a5))
(pad "B1" smd circle (at -1.4 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 029cb0ce-5187-4515-853a-aafe8ee809b3))
(pad "B2" smd circle (at -1 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 1353eb6e-cd74-4e6a-91a2-3d4280552cf3))
(pad "B3" smd circle (at -0.6 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp c9598cc3-3a8c-4c07-9c39-a7139c0962f7))
(pad "B4" smd circle (at -0.2 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 4f8affcb-7585-4b2c-8466-37a0f42c14bf))
(pad "B5" smd circle (at 0.2 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 26d94362-6744-4bb8-9e49-4ee66561431f))
(pad "B6" smd circle (at 0.6 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp fe98d118-8c86-4962-8d38-1794f47282a0))
(pad "B7" smd circle (at 1 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 2823ee20-d093-451b-ba4f-39ec41a44797))
(pad "B8" smd circle (at 1.4 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp a3850074-9554-48a5-bcd3-b456305f2ca1))
(pad "C1" smd circle (at -1.4 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 203db437-5fd7-467d-97fb-4e203731a64b))
(pad "C2" smd circle (at -1 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 22f1db35-fa8a-4b86-9a9a-ca45228dca5a))
(pad "C3" smd circle (at -0.6 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 6c73af1f-dbe9-4d7b-8948-58422e99529c))
(pad "C4" smd circle (at -0.2 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 8347bb49-c9cb-4ccb-9f04-767fb80d2dc0))
(pad "C5" smd circle (at 0.2 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 98913ad1-dca4-4c34-b54d-239cb1c6b221))
(pad "C6" smd circle (at 0.6 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp ad551e2d-8bd7-488d-b017-86918c3410eb))
(pad "C7" smd circle (at 1 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp b900ab28-8458-4daf-bd9d-ad46f4d88138))
(pad "C8" smd circle (at 1.4 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 0e6f928a-51c2-4a1f-a26c-3a9e288cc8a9))
(pad "D1" smd circle (at -1.4 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 34397c77-4546-4f54-8e76-b76005a51731))
(pad "D2" smd circle (at -1 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 6d4cddb0-1db5-4c73-a337-50859fee9cbc))
(pad "D3" smd circle (at -0.6 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp e832ea90-d6f5-491e-8b5c-61f550ba084b))
(pad "D4" smd circle (at -0.2 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 77d52f18-5954-4d05-b43c-f8e09c1cdf54))
(pad "D5" smd circle (at 0.2 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp a425567f-4097-4cd8-91f5-9f35f6f1e23d))
(pad "D6" smd circle (at 0.6 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 2a39f123-cf5d-4aa7-8ae5-a6627290b01b))
(pad "D7" smd circle (at 1 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 19d6e867-87d2-4f53-96ab-67d90d4de371))
(pad "D8" smd circle (at 1.4 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 25b5feb7-324c-4e2b-b038-839ff2ebd13f))
(pad "E1" smd circle (at -1.4 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp a2944852-62a8-4edd-994e-e6465f29cc79))
(pad "E2" smd circle (at -1 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp eaf29525-5f90-4272-9702-e02444764a49))
(pad "E3" smd circle (at -0.6 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 83803eab-490d-4221-9a92-733191e29f9a))
(pad "E4" smd circle (at -0.2 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 40d29ff2-2c0e-43b0-90bc-746de1a2f433))
(pad "E5" smd circle (at 0.2 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp e7ed1423-2a84-4cf9-880f-62baa4877679))
(pad "E6" smd circle (at 0.6 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 36177585-f672-4a06-ac98-041d206966ba))
(pad "E7" smd circle (at 1 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 1dbbb7ad-8c51-4259-a7e2-dd757d0dfed2))
(pad "E8" smd circle (at 1.4 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 9b0b8a07-fdad-4540-b4ed-78626d52296c))
(pad "F1" smd circle (at -1.4 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp e7f41ae5-965f-42f7-ad76-dc5e31592e92))
(pad "F2" smd circle (at -1 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 56737f4c-1d56-4634-9805-549e70916e39))
(pad "F3" smd circle (at -0.6 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp b9ac94a1-d825-4f18-8a9f-7769847ccdac))
(pad "F4" smd circle (at -0.2 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp de4e71ad-1103-471f-85a6-5dc109123bb8))
(pad "F5" smd circle (at 0.2 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 5c1ae8dd-33ff-4cc1-9ccd-912cc9c746b1))
(pad "F6" smd circle (at 0.6 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 469f47e3-dfa1-449e-a6ca-f0d0ad9cc46e))
(pad "F7" smd circle (at 1 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 311bc288-6d1c-48db-adac-952f237f1507))
(pad "F8" smd circle (at 1.4 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp ada1eeee-09b4-4026-ad40-073d42950194))
(pad "G1" smd circle (at -1.4 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp acef5d16-8d3c-483a-9c2e-3ba96f07fe4a))
(pad "G2" smd circle (at -1 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 84c5e648-f404-4c7e-9141-b4d3e2deffdd))
(pad "G3" smd circle (at -0.6 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 27e51c6f-0a2e-4ee4-a836-367f0a1ac665))
(pad "G4" smd circle (at -0.2 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 8cfec576-0650-4e45-ab39-2233dd77d9c8))
(pad "G5" smd circle (at 0.2 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 23ea7289-f8a6-48cc-a9d8-f8100f6b9aef))
(pad "G6" smd circle (at 0.6 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp c080e3d6-ad99-4f77-9af7-de97705068b9))
(pad "G7" smd circle (at 1 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp ad621f50-f403-4fcc-a1b6-4fd20e8c3fcf))
(pad "G8" smd circle (at 1.4 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 62962a81-fa6c-4663-9337-4335c0b76281))
(pad "H1" smd circle (at -1.4 1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 5635de3d-9191-41e2-8019-562adb110e7f))
(pad "H2" smd circle (at -1 1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp acbc7e73-622a-4489-beaa-0f17b9a21536))
(pad "H3" smd circle (at -0.6 1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp b2ded4be-28e8-4e48-9b0e-29b1b7f2a05d))
(pad "H4" smd circle (at -0.2 1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 4fe4ad3e-3bd6-40b9-983e-731b94ac595e))
(pad "H5" smd circle (at 0.2 1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp cf8e60e5-4304-4e59-932b-0aa748bbbd06))
(pad "H6" smd circle (at 0.6 1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 55a35d88-4b9b-4bb1-ba3e-772828d13ef9))
(pad "H7" smd circle (at 1 1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 44925905-669c-423c-9c11-4f74e981031c))
(pad "H8" smd circle (at 1.4 1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp ad02d335-dcea-49be-b0d4-1332487f167f))
(model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-64_Die462.wrl"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
|
