1 files changed, 165 insertions, 0 deletions
diff --git a/library/kicadLibrary/footprints/Package_CSP.pretty/ST_WLCSP-64_Die462.kicad_mod b/library/kicadLibrary/footprints/Package_CSP.pretty/ST_WLCSP-64_Die462.kicad_mod
new file mode 100644
index 00000000..4e2e66e4
--- /dev/null
+++ b/library/kicadLibrary/footprints/Package_CSP.pretty/ST_WLCSP-64_Die462.kicad_mod
@@ -0,0 +1,165 @@
+(footprint "ST_WLCSP-64_Die462" (version 20211014) (generator pcbnew)
+  (layer "F.Cu")
+  (tedit 5AE11EAD)
+  (descr "WLCSP-64, 8x8 raster, 3.357x3.657mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00340475.pdf")
+  (tags "BGA 64 0.4")
+  (attr smd)
+  (fp_text reference "REF**" (at 0 -2.8285) (layer "F.SilkS")
+    (effects (font (size 1 1) (thickness 0.15)))
+    (tstamp d53ae5c7-cf16-48b1-9733-03f2d1991a49)
+  )
+  (fp_text value "ST_WLCSP-64_Die462" (at 0 2.8285) (layer "F.Fab")
+    (effects (font (size 1 1) (thickness 0.15)))
+    (tstamp db664211-4ec9-4945-9ee1-18acfa571a6f)
+  )
+  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
+    (effects (font (size 0.78 0.78) (thickness 0.117)))
+    (tstamp 45289c01-9893-4e97-8d4c-ee6624a8e1dc)
+  )
+  (fp_line (start -1.8035 1.9535) (end -1.8035 -1.11425) (layer "F.SilkS") (width 0.12) (tstamp 1170f239-e109-4510-80d1-33601782c303))
+  (fp_line (start -0.96425 -1.9535) (end 1.8035 -1.9535) (layer "F.SilkS") (width 0.12) (tstamp 2a9cffd9-d474-4274-8654-67ec4b6c6612))
+  (fp_line (start 1.8035 -1.9535) (end 1.8035 1.9535) (layer "F.SilkS") (width 0.12) (tstamp 377ecdc6-8fd2-4eb4-8dcb-a38462b6ce6a))
+  (fp_line (start 1.8035 1.9535) (end -1.8035 1.9535) (layer "F.SilkS") (width 0.12) (tstamp f2c73e58-461e-408d-bea3-c1b2d0a805ef))
+  (fp_line (start 2.68 2.83) (end 2.68 -2.83) (layer "F.CrtYd") (width 0.05) (tstamp 226dcb40-c5d4-4d7a-ad3e-f4a2bf0c5842))
+  (fp_line (start 2.68 -2.83) (end -2.68 -2.83) (layer "F.CrtYd") (width 0.05) (tstamp 516d9ada-9b5b-484f-ab28-07d900069a37))
+  (fp_line (start -2.68 -2.83) (end -2.68 2.83) (layer "F.CrtYd") (width 0.05) (tstamp 95fa5702-a781-4785-a010-f84a93a3cf5f))
+  (fp_line (start -2.68 2.83) (end 2.68 2.83) (layer "F.CrtYd") (width 0.05) (tstamp c3ccfade-20f5-4403-81d2-0759b22a3229))
+  (fp_line (start 1.6785 1.8285) (end -1.6785 1.8285) (layer "F.Fab") (width 0.1) (tstamp 620a715b-31ab-4fec-af55-0d17fb0533a9))
+  (fp_line (start -1.6785 -0.98925) (end -0.83925 -1.8285) (layer "F.Fab") (width 0.1) (tstamp 8da40658-b1ad-4e42-8c23-324fcc61b086))
+  (fp_line (start -1.6785 1.8285) (end -1.6785 -0.98925) (layer "F.Fab") (width 0.1) (tstamp b04aa7f1-803e-4e04-9a70-d586ad11c853))
+  (fp_line (start 1.6785 -1.8285) (end 1.6785 1.8285) (layer "F.Fab") (width 0.1) (tstamp b14dd828-df6e-4990-a92c-ecff8b53b8e4))
+  (fp_line (start -0.83925 -1.8285) (end 1.6785 -1.8285) (layer "F.Fab") (width 0.1) (tstamp bc7bf03d-18ec-4fc8-a311-7a545ee59b5b))
+  (pad "A1" smd circle (at -1.4 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 9f22f16f-5e2a-4bcb-9349-cbd6b38cff32))
+  (pad "A2" smd circle (at -1 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 7f9ddfa7-86d2-42df-bd5d-d78e9802f4d9))
+  (pad "A3" smd circle (at -0.6 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 50e474b3-425f-4a70-bd40-2fd6edf928a8))
+  (pad "A4" smd circle (at -0.2 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 8658981f-85d3-4561-bc5d-b3b87dabeeae))
+  (pad "A5" smd circle (at 0.2 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 816dd0cb-568b-488b-a70e-3a4cb4c5e766))
+  (pad "A6" smd circle (at 0.6 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 9d4c03e5-9223-404c-b130-54866b9dd843))
+  (pad "A7" smd circle (at 1 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp f9e9008e-4bf1-4fce-9abd-462107caa92d))
+  (pad "A8" smd circle (at 1.4 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 0955479b-c328-41c3-a397-6bb03787a4a5))
+  (pad "B1" smd circle (at -1.4 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 029cb0ce-5187-4515-853a-aafe8ee809b3))
+  (pad "B2" smd circle (at -1 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 1353eb6e-cd74-4e6a-91a2-3d4280552cf3))
+  (pad "B3" smd circle (at -0.6 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp c9598cc3-3a8c-4c07-9c39-a7139c0962f7))
+  (pad "B4" smd circle (at -0.2 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 4f8affcb-7585-4b2c-8466-37a0f42c14bf))
+  (pad "B5" smd circle (at 0.2 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 26d94362-6744-4bb8-9e49-4ee66561431f))
+  (pad "B6" smd circle (at 0.6 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp fe98d118-8c86-4962-8d38-1794f47282a0))
+  (pad "B7" smd circle (at 1 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 2823ee20-d093-451b-ba4f-39ec41a44797))
+  (pad "B8" smd circle (at 1.4 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp a3850074-9554-48a5-bcd3-b456305f2ca1))
+  (pad "C1" smd circle (at -1.4 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 203db437-5fd7-467d-97fb-4e203731a64b))
+  (pad "C2" smd circle (at -1 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 22f1db35-fa8a-4b86-9a9a-ca45228dca5a))
+  (pad "C3" smd circle (at -0.6 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 6c73af1f-dbe9-4d7b-8948-58422e99529c))
+  (pad "C4" smd circle (at -0.2 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 8347bb49-c9cb-4ccb-9f04-767fb80d2dc0))
+  (pad "C5" smd circle (at 0.2 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 98913ad1-dca4-4c34-b54d-239cb1c6b221))
+  (pad "C6" smd circle (at 0.6 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp ad551e2d-8bd7-488d-b017-86918c3410eb))
+  (pad "C7" smd circle (at 1 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp b900ab28-8458-4daf-bd9d-ad46f4d88138))
+  (pad "C8" smd circle (at 1.4 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 0e6f928a-51c2-4a1f-a26c-3a9e288cc8a9))
+  (pad "D1" smd circle (at -1.4 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 34397c77-4546-4f54-8e76-b76005a51731))
+  (pad "D2" smd circle (at -1 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 6d4cddb0-1db5-4c73-a337-50859fee9cbc))
+  (pad "D3" smd circle (at -0.6 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp e832ea90-d6f5-491e-8b5c-61f550ba084b))
+  (pad "D4" smd circle (at -0.2 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 77d52f18-5954-4d05-b43c-f8e09c1cdf54))
+  (pad "D5" smd circle (at 0.2 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp a425567f-4097-4cd8-91f5-9f35f6f1e23d))
+  (pad "D6" smd circle (at 0.6 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 2a39f123-cf5d-4aa7-8ae5-a6627290b01b))
+  (pad "D7" smd circle (at 1 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 19d6e867-87d2-4f53-96ab-67d90d4de371))
+  (pad "D8" smd circle (at 1.4 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 25b5feb7-324c-4e2b-b038-839ff2ebd13f))
+  (pad "E1" smd circle (at -1.4 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp a2944852-62a8-4edd-994e-e6465f29cc79))
+  (pad "E2" smd circle (at -1 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp eaf29525-5f90-4272-9702-e02444764a49))
+  (pad "E3" smd circle (at -0.6 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 83803eab-490d-4221-9a92-733191e29f9a))
+  (pad "E4" smd circle (at -0.2 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 40d29ff2-2c0e-43b0-90bc-746de1a2f433))
+  (pad "E5" smd circle (at 0.2 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp e7ed1423-2a84-4cf9-880f-62baa4877679))
+  (pad "E6" smd circle (at 0.6 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 36177585-f672-4a06-ac98-041d206966ba))
+  (pad "E7" smd circle (at 1 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 1dbbb7ad-8c51-4259-a7e2-dd757d0dfed2))
+  (pad "E8" smd circle (at 1.4 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 9b0b8a07-fdad-4540-b4ed-78626d52296c))
+  (pad "F1" smd circle (at -1.4 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp e7f41ae5-965f-42f7-ad76-dc5e31592e92))
+  (pad "F2" smd circle (at -1 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 56737f4c-1d56-4634-9805-549e70916e39))
+  (pad "F3" smd circle (at -0.6 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp b9ac94a1-d825-4f18-8a9f-7769847ccdac))
+  (pad "F4" smd circle (at -0.2 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp de4e71ad-1103-471f-85a6-5dc109123bb8))
+  (pad "F5" smd circle (at 0.2 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 5c1ae8dd-33ff-4cc1-9ccd-912cc9c746b1))
+  (pad "F6" smd circle (at 0.6 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 469f47e3-dfa1-449e-a6ca-f0d0ad9cc46e))
+  (pad "F7" smd circle (at 1 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 311bc288-6d1c-48db-adac-952f237f1507))
+  (pad "F8" smd circle (at 1.4 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp ada1eeee-09b4-4026-ad40-073d42950194))
+  (pad "G1" smd circle (at -1.4 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp acef5d16-8d3c-483a-9c2e-3ba96f07fe4a))
+  (pad "G2" smd circle (at -1 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 84c5e648-f404-4c7e-9141-b4d3e2deffdd))
+  (pad "G3" smd circle (at -0.6 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 27e51c6f-0a2e-4ee4-a836-367f0a1ac665))
+  (pad "G4" smd circle (at -0.2 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 8cfec576-0650-4e45-ab39-2233dd77d9c8))
+  (pad "G5" smd circle (at 0.2 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 23ea7289-f8a6-48cc-a9d8-f8100f6b9aef))
+  (pad "G6" smd circle (at 0.6 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp c080e3d6-ad99-4f77-9af7-de97705068b9))
+  (pad "G7" smd circle (at 1 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp ad621f50-f403-4fcc-a1b6-4fd20e8c3fcf))
+  (pad "G8" smd circle (at 1.4 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 62962a81-fa6c-4663-9337-4335c0b76281))
+  (pad "H1" smd circle (at -1.4 1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 5635de3d-9191-41e2-8019-562adb110e7f))
+  (pad "H2" smd circle (at -1 1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp acbc7e73-622a-4489-beaa-0f17b9a21536))
+  (pad "H3" smd circle (at -0.6 1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp b2ded4be-28e8-4e48-9b0e-29b1b7f2a05d))
+  (pad "H4" smd circle (at -0.2 1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 4fe4ad3e-3bd6-40b9-983e-731b94ac595e))
+  (pad "H5" smd circle (at 0.2 1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp cf8e60e5-4304-4e59-932b-0aa748bbbd06))
+  (pad "H6" smd circle (at 0.6 1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 55a35d88-4b9b-4bb1-ba3e-772828d13ef9))
+  (pad "H7" smd circle (at 1 1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp 44925905-669c-423c-9c11-4f74e981031c))
+  (pad "H8" smd circle (at 1.4 1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_paste_margin_ratio 0.055556) (tstamp ad02d335-dcea-49be-b0d4-1332487f167f))
+  (model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-64_Die462.wrl"
+    (offset (xyz 0 0 0))
+    (scale (xyz 1 1 1))
+    (rotate (xyz 0 0 0))
+  )
+)