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(module ROHM_VML0806 (layer F.Cu) (tedit 598CB185)
(descr "VML0806, Rohm (http://rohmfs.rohm.com/en/techdata_basic/transistor/soldering_condition/VML0806_Soldering_Condition.pdf, http://rohmfs.rohm.com/en/products/databook/package/spec/discrete/vml0806_tr-e.pdf)")
(tags "ROHM VML0806")
(attr smd)
(fp_text reference REF** (at 0 -1.3) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value ROHM_VML0806 (at 0 1.3) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 0.1 0.42) (end -0.1 0.42) (layer F.SilkS) (width 0.12))
(fp_line (start 0.1 -0.42) (end -0.4 -0.42) (layer F.SilkS) (width 0.12))
(fp_line (start -0.7 0.6) (end -0.7 -0.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.7 0.6) (end -0.7 0.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.7 -0.6) (end 0.7 0.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -0.7 -0.6) (end 0.7 -0.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -0.15 -0.3) (end -0.4 -0.05) (layer F.Fab) (width 0.1))
(fp_line (start -0.4 0.3) (end -0.4 -0.05) (layer F.Fab) (width 0.1))
(fp_line (start 0.4 0.3) (end -0.4 0.3) (layer F.Fab) (width 0.1))
(fp_line (start 0.4 -0.3) (end 0.4 0.3) (layer F.Fab) (width 0.1))
(fp_line (start -0.15 -0.3) (end 0.4 -0.3) (layer F.Fab) (width 0.1))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.127 0.127) (thickness 0.02)))
)
(pad 2 smd rect (at -0.3 0.175) (size 0.3 0.25) (layers F.Cu F.Paste F.Mask))
(pad 1 smd rect (at -0.3 -0.175) (size 0.3 0.25) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at 0.3 0) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
(model ${KISYS3DMOD}/Housings_SON.3dshapes/ROHM_VML0806.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
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