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(module TI_SO-PowerPAD-8 (layer F.Cu) (tedit 594A9ED3)
(descr "8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf)")
(tags "SSOP 0.50 exposed pad")
(attr smd)
(fp_text reference REF** (at 0 -3.3) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value TI_SO-PowerPAD-8 (at 0 3.4) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -0.95 -2.45) (end 1.95 -2.45) (layer F.Fab) (width 0.15))
(fp_line (start 1.95 -2.45) (end 1.95 2.45) (layer F.Fab) (width 0.15))
(fp_line (start 1.95 2.45) (end -1.95 2.45) (layer F.Fab) (width 0.15))
(fp_line (start -1.95 2.45) (end -1.95 -1.45) (layer F.Fab) (width 0.15))
(fp_line (start -1.95 -1.45) (end -0.95 -2.45) (layer F.Fab) (width 0.15))
(fp_line (start -4 -2.7) (end -4 2.7) (layer F.CrtYd) (width 0.05))
(fp_line (start 4 -2.7) (end 4 2.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -4 -2.7) (end 4 -2.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -4 2.7) (end 4 2.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -2.575) (end -2.075 -2.375) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -2.575) (end 2.075 -2.375) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 2.575) (end 2.075 2.375) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end -2.075 2.375) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.375) (end -3.375 -2.375) (layer F.SilkS) (width 0.15))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(pad 1 smd rect (at -2.78 -1.905) (size 1.91 0.61) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -2.78 -0.635) (size 1.91 0.61) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -2.78 0.635) (size 1.91 0.61) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -2.78 1.905) (size 1.91 0.61) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at 2.78 1.905) (size 1.91 0.61) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at 2.78 0.635) (size 1.91 0.61) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at 2.78 -0.635) (size 1.91 0.61) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at 2.78 -1.905) (size 1.91 0.61) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 0.6025 0.775) (size 1.205 1.55) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 9 smd rect (at 0.6025 -0.775) (size 1.205 1.55) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 9 smd rect (at -0.6025 0.775) (size 1.205 1.55) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 9 smd rect (at -0.6025 -0.775) (size 1.205 1.55) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(model ${KISYS3DMOD}/Housings_SOIC.3dshapes/TI_SO-PowerPAD-8.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
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