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(module SOIC-8-1EP_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 58CC8F64)
(descr "8-Lead Thermally Enhanced Plastic Small Outline (SE) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(attr smd)
(fp_text reference REF** (at 0 -3.5) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value SOIC-8-1EP_3.9x4.9mm_Pitch1.27mm (at 0 3.5) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.9 0.9) (thickness 0.135)))
)
(fp_line (start -0.95 -2.45) (end 1.95 -2.45) (layer F.Fab) (width 0.15))
(fp_line (start 1.95 -2.45) (end 1.95 2.45) (layer F.Fab) (width 0.15))
(fp_line (start 1.95 2.45) (end -1.95 2.45) (layer F.Fab) (width 0.15))
(fp_line (start -1.95 2.45) (end -1.95 -1.45) (layer F.Fab) (width 0.15))
(fp_line (start -1.95 -1.45) (end -0.95 -2.45) (layer F.Fab) (width 0.15))
(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -2.575) (end -2.075 -2.525) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.525) (end -3.475 -2.525) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at 2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at 2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at 2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at 2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 0.5875 0.5875) (size 1.175 1.175) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 9 smd rect (at 0.5875 -0.5875) (size 1.175 1.175) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 9 smd rect (at -0.5875 0.5875) (size 1.175 1.175) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 9 smd rect (at -0.5875 -0.5875) (size 1.175 1.175) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(model ${KISYS3DMOD}/Housings_SOIC.3dshapes/SOIC-8-1EP_3.9x4.9mm_Pitch1.27mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
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