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(footprint "TSSOP-28-1EP_4.4x9.7mm_P0.65mm" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 5A02F25C)
(descr "TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; Exposed Pad Variation; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot361-1_po.pdf)")
(tags "SSOP 0.65")
(attr smd)
(fp_text reference "REF**" (at 0 -5.9) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 2f63d754-c083-495d-a57d-aacf3018baf3)
)
(fp_text value "TSSOP-28-1EP_4.4x9.7mm_P0.65mm" (at 0 5.9) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp ec0e3b60-d9b5-4b0f-9ec0-ba4e05c457b4)
)
(fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
(effects (font (size 0.8 0.8) (thickness 0.15)))
(tstamp b8a8355d-eb0d-4fb0-abf1-a6ff81b87cb4)
)
(fp_line (start 2.325 4.975) (end 2.325 4.65) (layer "F.SilkS") (width 0.15) (tstamp 1b832f02-a53b-460a-91cf-08f728fd83af))
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(fp_line (start -2.325 -4.975) (end -2.325 -4.75) (layer "F.SilkS") (width 0.15) (tstamp 6a672ba4-1e0e-4c8e-b862-0630a17a48c6))
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(fp_line (start -2.325 4.975) (end 2.325 4.975) (layer "F.SilkS") (width 0.15) (tstamp c3d8a113-d313-4aff-a85b-5614b56d93d2))
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(fp_line (start -1.2 -4.85) (end 2.2 -4.85) (layer "F.Fab") (width 0.15) (tstamp a7f5f017-878f-4fdf-b399-1bf1d28d8621))
(fp_line (start 2.2 -4.85) (end 2.2 4.85) (layer "F.Fab") (width 0.15) (tstamp bc140972-6c1f-48a3-85f9-98f8194a449c))
(fp_line (start -2.2 -3.85) (end -1.2 -4.85) (layer "F.Fab") (width 0.15) (tstamp caf6ba19-6ab2-401e-84c9-07d056c785ee))
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(pad "6" smd rect (at -2.85 -0.975) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp abdda84b-acd6-4df7-9d20-7ba2d74e876f))
(pad "7" smd rect (at -2.85 -0.325) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp e7243502-6658-417e-b365-65fcf3fb8cbf))
(pad "8" smd rect (at -2.85 0.325) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a2f899e1-32a1-408a-9bcd-f3539b1d4212))
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(pad "13" smd rect (at -2.85 3.575) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a23ba147-89dc-4edc-add2-96b289cf763d))
(pad "14" smd rect (at -2.85 4.225) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp aff0b798-4d63-4b0f-9b04-8fafbf0b5422))
(pad "15" smd rect (at 2.85 4.225) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp fdf7583f-40f1-42e5-85d3-a77fd1f8f64c))
(pad "16" smd rect (at 2.85 3.575) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a61c4369-4d2f-4b9d-9968-463616206e19))
(pad "17" smd rect (at 2.85 2.925) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 8e9adacb-b747-430a-b01f-bfdaf3a565c2))
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(pad "19" smd rect (at 2.85 1.625) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 0cb5e048-6544-40ba-a36e-72ba7f9083ff))
(pad "20" smd rect (at 2.85 0.975) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 15991fca-f6ec-4c1f-b740-f8631828e0b0))
(pad "21" smd rect (at 2.85 0.325) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp f2c734fd-5395-491e-a08a-fdbfaf10b09f))
(pad "22" smd rect (at 2.85 -0.325) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp caa8d62b-daf6-4f95-b13e-70f60b44b139))
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(pad "28" smd rect (at 2.85 -4.225) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp d14616e3-65e5-40ce-9b1e-93297444bbc9))
(pad "29" smd rect (at -0.6 -2.31375) (size 1.2 1.5425) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio -0.2) (tstamp 247b2a5c-8916-4ccf-bec3-a24f3e9fd0d8))
(pad "29" smd rect (at -0.6 -0.77125) (size 1.2 1.5425) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio -0.2) (tstamp 248174b4-f500-4316-b8f4-fda372d3e5e9))
(pad "29" smd rect (at -0.6 0.77125) (size 1.2 1.5425) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio -0.2) (tstamp 248997f2-c686-4cb3-acd8-24837eb2e0d3))
(pad "29" smd rect (at -0.6 2.31375) (size 1.2 1.5425) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio -0.2) (tstamp 8a7dfce6-66f5-49db-9f84-c9ceabd69c7e))
(pad "29" smd rect (at 0.6 2.31375) (size 1.2 1.5425) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio -0.2) (tstamp c10d22f2-8bba-4ece-9aa4-a47a39fc1b36))
(pad "29" smd rect (at 0.6 -0.77125) (size 1.2 1.5425) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio -0.2) (tstamp d4b322cc-9391-4e0b-a2af-a502c8c50f19))
(pad "29" smd rect (at 0.6 0.77125) (size 1.2 1.5425) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio -0.2) (tstamp e6e68165-5ae2-42c5-b8af-016fa621a0a7))
(pad "29" smd rect (at 0.6 -2.31375) (size 1.2 1.5425) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio -0.2) (tstamp f076fab1-81d3-4442-b085-b072306f77ec))
(model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/TSSOP-28_4.4x9.7mm_Pitch0.65mm.wrl"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
|
