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(footprint "TI_SO-PowerPAD-8" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 5A02F2D3)
(descr "8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf)")
(tags "SSOP 0.50 exposed pad")
(attr smd)
(fp_text reference "REF**" (at 0 -3.3) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 76dfc6c2-dfba-41cf-b88f-87c5ccaab587)
)
(fp_text value "TI_SO-PowerPAD-8" (at 0 3.4) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 4b0263c7-71f9-47e7-ba94-03b8e537a06b)
)
(fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 3771af48-88aa-43ef-9adf-0247ae1807cc)
)
(fp_line (start -2.075 2.575) (end -2.075 2.375) (layer "F.SilkS") (width 0.15) (tstamp 02dfe3fb-b5e3-4d48-9898-8d2524c2b6bc))
(fp_line (start 2.075 -2.575) (end 2.075 -2.375) (layer "F.SilkS") (width 0.15) (tstamp 6736ece9-31af-4853-bb47-561d2322092e))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer "F.SilkS") (width 0.15) (tstamp 6b05a05d-1e24-4f64-af17-b31d94eb6a2f))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer "F.SilkS") (width 0.15) (tstamp 952a71c7-019c-40f7-bf87-f24eae523d67))
(fp_line (start 2.075 2.575) (end 2.075 2.375) (layer "F.SilkS") (width 0.15) (tstamp bcf24a9b-962d-402b-a3f4-8ee5a16869d2))
(fp_line (start -2.075 -2.575) (end -2.075 -2.375) (layer "F.SilkS") (width 0.15) (tstamp c4f7a487-ac29-4983-8547-7b371c016ef3))
(fp_line (start -2.075 -2.375) (end -3.375 -2.375) (layer "F.SilkS") (width 0.15) (tstamp f592f8b2-227e-47bb-872b-a7684bfbe91f))
(fp_line (start -4 -2.7) (end 4 -2.7) (layer "F.CrtYd") (width 0.05) (tstamp 09958cc5-9034-4eb0-8bf6-bb2c27be24c4))
(fp_line (start -4 2.7) (end 4 2.7) (layer "F.CrtYd") (width 0.05) (tstamp 14497c76-5084-479d-903a-be55f3e82e9e))
(fp_line (start -4 -2.7) (end -4 2.7) (layer "F.CrtYd") (width 0.05) (tstamp 468b4d46-891a-4ac2-be39-645979c5658a))
(fp_line (start 4 -2.7) (end 4 2.7) (layer "F.CrtYd") (width 0.05) (tstamp d15c6388-0087-4858-97af-c09a653e939d))
(fp_line (start -1.95 2.45) (end -1.95 -1.45) (layer "F.Fab") (width 0.15) (tstamp 3091f91f-77fa-49ba-b835-9237e3dcd2a6))
(fp_line (start -1.95 -1.45) (end -0.95 -2.45) (layer "F.Fab") (width 0.15) (tstamp 3bc1ea76-3cdc-4a8a-815b-9a529ecae57c))
(fp_line (start 1.95 -2.45) (end 1.95 2.45) (layer "F.Fab") (width 0.15) (tstamp 4de21e3c-3f89-4f09-8840-613afff96693))
(fp_line (start 1.95 2.45) (end -1.95 2.45) (layer "F.Fab") (width 0.15) (tstamp 66022c8a-1ea6-4c46-bf25-f418961567a0))
(fp_line (start -0.95 -2.45) (end 1.95 -2.45) (layer "F.Fab") (width 0.15) (tstamp 9002ccf2-8a60-45dc-972f-12aa0bd077fb))
(pad "1" smd rect (at -2.78 -1.905) (size 1.91 0.61) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 87aefb81-aa1b-47a5-87be-b6ac3fc76547))
(pad "2" smd rect (at -2.78 -0.635) (size 1.91 0.61) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 2f750416-bf17-4e39-b3bb-f85aa440fd50))
(pad "3" smd rect (at -2.78 0.635) (size 1.91 0.61) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 36f210d4-850a-42fb-b0e1-65ec6930f597))
(pad "4" smd rect (at -2.78 1.905) (size 1.91 0.61) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 2d2d8909-917d-4c80-a158-fe3311de7da1))
(pad "5" smd rect (at 2.78 1.905) (size 1.91 0.61) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp ef9095bf-950e-419f-8852-21dca4fa715a))
(pad "6" smd rect (at 2.78 0.635) (size 1.91 0.61) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 1a4a214d-2061-4619-b7c0-31242f4641e8))
(pad "7" smd rect (at 2.78 -0.635) (size 1.91 0.61) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 0cee3308-3b50-4aaa-9e72-edc792efa845))
(pad "8" smd rect (at 2.78 -1.905) (size 1.91 0.61) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 6ada3559-739a-4e69-8922-5f46c3837109))
(pad "9" smd rect (at -0.6025 -0.775) (size 1.205 1.55) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio -0.2) (tstamp 3dea7421-f9dd-424c-a2f4-f2900864096f))
(pad "9" smd rect (at 0.6025 -0.775) (size 1.205 1.55) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio -0.2) (tstamp 6bd4be4a-30c5-4811-8705-2d3173d4b547))
(pad "9" smd rect (at -0.6025 0.775) (size 1.205 1.55) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio -0.2) (tstamp 73b9759e-a7a0-4881-8dc1-dcebc919dddd))
(pad "9" smd rect (at 0.6025 0.775) (size 1.205 1.55) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio -0.2) (tstamp c56f497b-0492-4bef-93d8-3e34169b3252))
(model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/TI_SO-PowerPAD-8.wrl"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
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