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(footprint "SSOP-56_7.5x18.5mm_P0.635mm" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 5A02F25C)
(descr "SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf)")
(tags "SSOP 0.635")
(attr smd)
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(effects (font (size 1 1) (thickness 0.15)))
(tstamp 633841aa-3331-4353-b729-d6ca6b2623cc)
)
(fp_text value "SSOP-56_7.5x18.5mm_P0.635mm" (at 0 10.275) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 460958d1-f721-49d1-9e3d-b78c1b419327)
)
(fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
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(tstamp b5267f1e-c360-4ea5-ade6-92a0f5948b14)
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(model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/SSOP-56_7.5x18.5mm_P0.635mm.wrl"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
|
