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(footprint "ST_WLCSP-81_Die463" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 5AE11EAD)
(descr "WLCSP-81, 9x9 raster, 4.039x3.951mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00282249.pdf")
(tags "BGA 81 0.4")
(attr smd)
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(effects (font (size 1 1) (thickness 0.15)))
(tstamp f66aeaee-9e7f-4f3f-b518-7fadd8d51faa)
)
(fp_text value "ST_WLCSP-81_Die463" (at 0 2.9755) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp b3751428-f3f6-433f-8278-eb04fb2d0c42)
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(fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
(effects (font (size 0.94 0.94) (thickness 0.141)))
(tstamp ba02e5c7-5802-49e8-8f06-380d2549b7df)
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(solder_paste_margin_ratio 0.055556) (tstamp 5ea16738-1224-469a-a5a2-42ecb13f28b0))
(pad "H5" smd circle (at 0 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp cabd34f6-7999-48a6-8c57-06a149bdc46a))
(pad "H6" smd circle (at 0.4 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp e41502f8-08b7-47b3-9e80-3db4d3077a58))
(pad "H7" smd circle (at 0.8 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 0a8258a0-e1fe-43f4-9893-586baed0af58))
(pad "H8" smd circle (at 1.2 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 8b945bad-4df4-4b54-abb6-37d7c3c2f523))
(pad "H9" smd circle (at 1.6 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 6694f641-8ec2-43fb-a982-b2e1d6d20c73))
(pad "J1" smd circle (at -1.6 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 9ecc00dd-cfc2-48c2-b1e1-13c4afa8c0fe))
(pad "J2" smd circle (at -1.2 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 4432d9af-fa7d-42ca-8ff9-f2f6edcdec09))
(pad "J3" smd circle (at -0.8 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp f2177e4d-365e-4a4a-9bd3-624497189314))
(pad "J4" smd circle (at -0.4 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 0a0426fa-aa58-43eb-b885-5d8c73f2ad0c))
(pad "J5" smd circle (at 0 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 1daefb1e-4dc5-4f0c-adfa-73cbc462fd11))
(pad "J6" smd circle (at 0.4 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp fe82f6bd-4dc1-402a-87e6-3a8de62516b7))
(pad "J7" smd circle (at 0.8 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 7a02f8a9-1668-4a20-ad2d-b2e130df836d))
(pad "J8" smd circle (at 1.2 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 38d0a9ef-a697-4c7e-93ed-48e4d1200d26))
(pad "J9" smd circle (at 1.6 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 50c880ca-432d-4bf7-b241-6e648809a699))
(model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-81_Die463.wrl"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
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