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(footprint "ST_WLCSP-81_Die421" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 5AE11EAD)
(descr "WLCSP-81, 9x9 raster, 3.693x3.815mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf")
(tags "BGA 81 0.4")
(attr smd)
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(effects (font (size 1 1) (thickness 0.15)))
(tstamp 63bd7ed2-f6d8-4e2d-8c37-8ec793ae5122)
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(effects (font (size 1 1) (thickness 0.15)))
(tstamp c11540c1-3d17-4ae1-83c1-c39f0b4b9fb7)
)
(fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
(effects (font (size 0.86 0.86) (thickness 0.129)))
(tstamp b156d973-6e47-4e4b-90fb-921408435c17)
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(solder_paste_margin_ratio 0.055556) (tstamp e3708023-b69c-4a99-9ccc-75fa6e9a5728))
(pad "H4" smd circle (at -0.4 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 8436610e-9432-4b0b-b0cd-bdb7f601621a))
(pad "H5" smd circle (at 0 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 960dbf87-6309-44bc-9255-4daa5e037f35))
(pad "H6" smd circle (at 0.4 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 10f25e8d-2260-46a4-be7a-3d282bbc3bd9))
(pad "H7" smd circle (at 0.8 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 1ce052d1-e6fe-47d1-b260-4410ede70424))
(pad "H8" smd circle (at 1.2 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 95a2f63c-9ef1-479f-8957-5ddf239e9443))
(pad "H9" smd circle (at 1.6 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 9f19df47-f0f1-406e-8f7e-f9fca2878a52))
(pad "J1" smd circle (at -1.6 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 219fa8ef-2f45-4360-94a0-aa20a20d5133))
(pad "J2" smd circle (at -1.2 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp c0a3bccd-c4aa-46de-83a0-e080fe16c185))
(pad "J3" smd circle (at -0.8 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 1c404afe-932b-4e29-b837-38fb925e0089))
(pad "J4" smd circle (at -0.4 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 17f87316-ed17-4043-8080-9a91716d83e5))
(pad "J5" smd circle (at 0 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp eae64d45-c74c-4471-b0c9-d0d98477e0aa))
(pad "J6" smd circle (at 0.4 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 48aaa59d-8564-4098-bb88-f440d4c401d5))
(pad "J7" smd circle (at 0.8 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 08071055-c56b-47eb-b5d7-c1fd49b1451c))
(pad "J8" smd circle (at 1.2 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp b5e5b721-ddaf-468b-92f5-1ed9b948c736))
(pad "J9" smd circle (at 1.6 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 96807702-0008-44db-af94-d3497c978d10))
(model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-81_Die421.wrl"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
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