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(footprint "ST_WLCSP-72_Die415" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 5AE11EAD)
(descr "WLCSP-72, 9x9 raster, 4.4084x3.7594mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf")
(tags "BGA 72 0.4")
(attr smd)
(fp_text reference "REF**" (at 0 -2.8797) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp a2ad3c59-ca5e-4b1c-ac55-6c3dbd89b4c5)
)
(fp_text value "ST_WLCSP-72_Die415" (at 0 2.8797) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 1c2d828f-7eda-449f-950e-d2cb66c1d4f4)
)
(fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 19472cae-0217-4f8c-8c71-c108b677f21f)
)
(fp_line (start -1.38935 -2.0047) (end 2.3292 -2.0047) (layer "F.SilkS") (width 0.12) (tstamp 00b60028-41c1-418e-9df0-f1ca2e8ed1eb))
(fp_line (start -2.3292 2.0047) (end -2.3292 -1.06485) (layer "F.SilkS") (width 0.12) (tstamp 1bb67b8c-59f8-4582-aaa7-58221781fdf4))
(fp_line (start 2.3292 -2.0047) (end 2.3292 2.0047) (layer "F.SilkS") (width 0.12) (tstamp 32567988-6c7b-424e-a87e-4e7f968bf03a))
(fp_line (start 2.3292 2.0047) (end -2.3292 2.0047) (layer "F.SilkS") (width 0.12) (tstamp a32da060-7ae0-431d-a3c6-a734a1edac2f))
(fp_line (start -3.21 -2.88) (end -3.21 2.88) (layer "F.CrtYd") (width 0.05) (tstamp 0c0fe961-e683-49db-9c9b-5ed4f8b161ba))
(fp_line (start 3.21 -2.88) (end -3.21 -2.88) (layer "F.CrtYd") (width 0.05) (tstamp 20732496-3b86-4540-8011-d2fee93616a6))
(fp_line (start -3.21 2.88) (end 3.21 2.88) (layer "F.CrtYd") (width 0.05) (tstamp 9603c59a-a0c6-4dec-aa7e-436e356caee9))
(fp_line (start 3.21 2.88) (end 3.21 -2.88) (layer "F.CrtYd") (width 0.05) (tstamp a4cc46ec-a9a0-43bb-bc6c-03a32b892572))
(fp_line (start 2.2042 1.8797) (end -2.2042 1.8797) (layer "F.Fab") (width 0.1) (tstamp 0fd665fa-a956-4e20-9dc6-56bef9202f40))
(fp_line (start 2.2042 -1.8797) (end 2.2042 1.8797) (layer "F.Fab") (width 0.1) (tstamp 3b969530-5ed1-4d32-983a-2633a00c34e9))
(fp_line (start -2.2042 -0.93985) (end -1.26435 -1.8797) (layer "F.Fab") (width 0.1) (tstamp 8e865e39-16c1-4ac8-83bd-85f332b338a7))
(fp_line (start -1.26435 -1.8797) (end 2.2042 -1.8797) (layer "F.Fab") (width 0.1) (tstamp a2ae03a6-5f74-445c-ba4e-1203eca4c4dd))
(fp_line (start -2.2042 1.8797) (end -2.2042 -0.93985) (layer "F.Fab") (width 0.1) (tstamp f7e81299-a416-4025-ad9f-aa27538f6e85))
(pad "A1" smd circle (at -1.6 -1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp c52ae7ac-acde-4296-bfa8-b094d44a9988))
(pad "A2" smd circle (at -1.2 -1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp c8318ce3-32b0-414b-9fd0-11531f310ea5))
(pad "A3" smd circle (at -0.8 -1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 066896d7-5f8b-4a74-ac5c-403e0e342233))
(pad "A4" smd circle (at -0.4 -1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp b5f06d9b-4f95-4c78-9c13-6ab0d5e3a9aa))
(pad "A5" smd circle (at 0 -1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 7f5c421e-91f0-45d1-8399-dacb09936946))
(pad "A6" smd circle (at 0.4 -1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp b360e9e9-e3a6-4f83-a041-7811a47f5a55))
(pad "A7" smd circle (at 0.8 -1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 2323c6ae-5102-40cf-a266-d02d09b60bf2))
(pad "A8" smd circle (at 1.2 -1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp ebfa9e66-03b3-4fc9-8d2e-780c7165c92a))
(pad "A9" smd circle (at 1.6 -1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 57edd3ce-9826-4a55-adbb-afdb0dc23fb3))
(pad "B1" smd circle (at -1.6 -1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp b13f64f5-356a-4a72-b517-f979a48dffd7))
(pad "B2" smd circle (at -1.2 -1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp c687de4a-1d71-42e2-9757-d633d437bb16))
(pad "B3" smd circle (at -0.8 -1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 8b67c9ae-7991-4341-acc7-45feeb600117))
(pad "B4" smd circle (at -0.4 -1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 2236e159-868c-4a10-bf74-6034f1e91690))
(pad "B5" smd circle (at 0 -1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 6b0f5905-d628-49a3-a234-2d993197d5d9))
(pad "B6" smd circle (at 0.4 -1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 78b4fc47-e394-4526-b73b-32ebba02621f))
(pad "B7" smd circle (at 0.8 -1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 08e30553-6239-4e48-a566-2dcf82ef0aa5))
(pad "B8" smd circle (at 1.2 -1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 509c003a-0155-48df-a218-f6dd99e1a027))
(pad "B9" smd circle (at 1.6 -1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 9b3b3d6b-d0f0-4afd-b617-93fe4511031d))
(pad "C1" smd circle (at -1.6 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 2ea9cedf-0d0c-4dbe-8f43-0c62b914127e))
(pad "C2" smd circle (at -1.2 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp dd751492-d5ae-4c1f-aef3-8944b928f4ed))
(pad "C3" smd circle (at -0.8 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 1905b9ec-36b0-4446-aac1-57fc251935f3))
(pad "C4" smd circle (at -0.4 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp c07e6b5b-e0bc-467b-80b4-26e76770572b))
(pad "C5" smd circle (at 0 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 865122a9-3910-4afa-8d99-78b9aac8e0f2))
(pad "C6" smd circle (at 0.4 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 0860193b-c7f8-495c-a2cb-f33d221cff92))
(pad "C7" smd circle (at 0.8 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp d08250b7-1543-4f14-af96-7a7570af101b))
(pad "C8" smd circle (at 1.2 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 6a44f15d-5035-41ac-a74c-f77842e19f09))
(pad "C9" smd circle (at 1.6 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp ee685945-1381-4222-83ce-335919fb4aca))
(pad "D1" smd circle (at -1.6 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 1ab783c6-7d36-420b-a199-7e76c727a076))
(pad "D2" smd circle (at -1.2 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 91705680-2470-4c6d-b454-205815b30f6f))
(pad "D3" smd circle (at -0.8 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 681b1c23-dac7-4f13-b630-5922acff6c07))
(pad "D7" smd circle (at 0.8 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp b7294404-5cee-44be-9d27-c2345c7b6a92))
(pad "D8" smd circle (at 1.2 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 0ee9a465-ccf8-414d-97a6-6079d45df115))
(pad "D9" smd circle (at 1.6 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 315f530f-1435-4df7-88f0-7efa86f26606))
(pad "E1" smd circle (at -1.6 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp afe5b9ae-37e2-4861-94af-f8973eb35944))
(pad "E2" smd circle (at -1.2 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 74e7a502-983e-4d81-a937-6e37f6782d29))
(pad "E3" smd circle (at -0.8 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 5410f28e-4c00-4dae-91f1-9d2f0de2310a))
(pad "E7" smd circle (at 0.8 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp a20cc982-8647-46d1-a3e3-0d1fd5a3decf))
(pad "E8" smd circle (at 1.2 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 31f2bc1d-e263-4c07-a9b8-2a3eeb102a9e))
(pad "E9" smd circle (at 1.6 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp e37fb00c-801f-457f-bf6a-596553a07c47))
(pad "F1" smd circle (at -1.6 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 5e032428-bfd1-4310-b1ab-ae63280f2f63))
(pad "F2" smd circle (at -1.2 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 1dc4bcf6-bc0c-41b3-b94e-f8c8790733b4))
(pad "F3" smd circle (at -0.8 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 4eff258e-df52-4d17-8a1c-3fe4ab73bfe7))
(pad "F7" smd circle (at 0.8 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 43c58aaf-c3a0-45d8-bb6b-50cb401d3fbf))
(pad "F8" smd circle (at 1.2 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 88dae985-b583-41e7-97a1-4515b191bb70))
(pad "F9" smd circle (at 1.6 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp ab847728-6b68-4002-b019-8af9fe79e8d9))
(pad "G1" smd circle (at -1.6 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 6c7806a2-fc96-47eb-b3ba-4cfee3682950))
(pad "G2" smd circle (at -1.2 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp b3fa2c41-5883-47f6-b258-ce24119ac267))
(pad "G3" smd circle (at -0.8 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp a3d614b5-e4e8-47b5-a9af-89ce60c42f55))
(pad "G4" smd circle (at -0.4 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 65ba1571-e6a5-4c4f-a559-fa538d759146))
(pad "G5" smd circle (at 0 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 71f72cae-7f29-4cb7-8653-1e73ac38d32b))
(pad "G6" smd circle (at 0.4 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 56683cce-18a4-42f4-b033-33b6f31becd7))
(pad "G7" smd circle (at 0.8 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 1ab7aa80-ffdd-4e93-9cf3-c37e1e33db59))
(pad "G8" smd circle (at 1.2 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 79c29389-87be-4e3f-959a-5f4c0b5ec01f))
(pad "G9" smd circle (at 1.6 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 3086c6af-ce18-46bf-9437-e69fb12aab48))
(pad "H1" smd circle (at -1.6 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 40bd90ee-a394-49d9-85f2-d33429233dfa))
(pad "H2" smd circle (at -1.2 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 8c08912c-2ccf-4a56-a737-5d59aa6d2b8a))
(pad "H3" smd circle (at -0.8 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp c77505e7-0c5c-4547-8317-2dc394bcd1bc))
(pad "H4" smd circle (at -0.4 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 6bfe8ca5-4143-44fd-8cc2-e8429f9cda3e))
(pad "H5" smd circle (at 0 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp fba6c753-3aec-4429-81b0-b41b50f43fb5))
(pad "H6" smd circle (at 0.4 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp fdf20b6a-72be-406a-b709-f8a392d98f69))
(pad "H7" smd circle (at 0.8 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp ea818a71-fbcf-4596-aa22-d6777d2576ea))
(pad "H8" smd circle (at 1.2 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 50d57b64-3ea3-4144-bec5-2f66505cdd15))
(pad "H9" smd circle (at 1.6 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp e4ff603d-0659-4e1e-81cc-62ce975f829f))
(pad "J1" smd circle (at -1.6 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 9f6b7340-e523-4c84-b917-0383eb3e6f23))
(pad "J2" smd circle (at -1.2 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp b5870f7f-835a-45dc-9386-a7c6950d04f3))
(pad "J3" smd circle (at -0.8 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 82af7230-34b8-4508-9b6f-03e3dc98d162))
(pad "J4" smd circle (at -0.4 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 382c811f-bf15-44d8-927e-9bac654a0289))
(pad "J5" smd circle (at 0 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 75cb99ce-23c6-46ef-bf3f-66a21bbbb533))
(pad "J6" smd circle (at 0.4 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 01e84f5f-a5d8-4459-bd24-4b2ee6b5a21d))
(pad "J7" smd circle (at 0.8 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 198ccfa4-579a-4f79-9865-4bc3c3546aa9))
(pad "J8" smd circle (at 1.2 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 11e07619-df1a-45db-b7db-107c4c1d3889))
(pad "J9" smd circle (at 1.6 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp 4f5b2961-c1fc-456f-873e-dd918005dcd3))
(model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-72_Die415.wrl"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
|
