blob: 5d4eab38f1149f318a15a426daac201ef2b208a0 (
plain)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
|
(footprint "ST_WLCSP-64_Die435" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 5AE11EAD)
(descr "WLCSP-64, 8x8 raster, 3.141x3.127mm package, pitch 0.35mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00257211.pdf")
(tags "BGA 64 0.35")
(attr smd)
(fp_text reference "REF**" (at 0 -2.5635) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 0c5b9359-0b7e-4095-8e24-7bc4b4938b14)
)
(fp_text value "ST_WLCSP-64_Die435" (at 0 2.5635) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp d39335c6-e1b1-4b07-94be-7820c790b503)
)
(fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
(effects (font (size 0.73 0.73) (thickness 0.1095)))
(tstamp f606875b-426c-4cf7-8917-e616d1a0bd16)
)
(fp_line (start -1.6955 1.6885) (end -1.6955 -0.90675) (layer "F.SilkS") (width 0.12) (tstamp 15450853-b93f-4b19-bf8c-120023319cdc))
(fp_line (start 1.6955 -1.6885) (end 1.6955 1.6885) (layer "F.SilkS") (width 0.12) (tstamp 338c9bbc-6db0-488d-b182-b3094db82b1b))
(fp_line (start -0.91375 -1.6885) (end 1.6955 -1.6885) (layer "F.SilkS") (width 0.12) (tstamp 4beb7afe-c5fa-40e5-bf1a-5920afcfe648))
(fp_line (start 1.6955 1.6885) (end -1.6955 1.6885) (layer "F.SilkS") (width 0.12) (tstamp 6ed7711c-094f-4f89-8724-47bc609a4f62))
(fp_line (start 2.58 -2.57) (end -2.58 -2.57) (layer "F.CrtYd") (width 0.05) (tstamp 26a44eb5-2214-4b13-809e-b35ab14360d0))
(fp_line (start 2.58 2.57) (end 2.58 -2.57) (layer "F.CrtYd") (width 0.05) (tstamp 4deac565-617b-49ca-aed2-740bf491bdf7))
(fp_line (start -2.58 -2.57) (end -2.58 2.57) (layer "F.CrtYd") (width 0.05) (tstamp c05ab9d5-a9ee-4da9-8aa5-52057c51ad27))
(fp_line (start -2.58 2.57) (end 2.58 2.57) (layer "F.CrtYd") (width 0.05) (tstamp d41f7446-e985-4afb-9021-943d83c114b3))
(fp_line (start -0.78875 -1.5635) (end 1.5705 -1.5635) (layer "F.Fab") (width 0.1) (tstamp 32bccd1c-77a1-4a2f-9fca-4ee01a47258f))
(fp_line (start -1.5705 -0.78175) (end -0.78875 -1.5635) (layer "F.Fab") (width 0.1) (tstamp 3a9bb6c9-59fd-425e-88ef-fab9cc1571fd))
(fp_line (start 1.5705 -1.5635) (end 1.5705 1.5635) (layer "F.Fab") (width 0.1) (tstamp 5e12c2d8-8ae4-4bc7-a0b4-d893f0172484))
(fp_line (start 1.5705 1.5635) (end -1.5705 1.5635) (layer "F.Fab") (width 0.1) (tstamp 9b5043c2-60ed-49e0-9cac-62bce7c092ee))
(fp_line (start -1.5705 1.5635) (end -1.5705 -0.78175) (layer "F.Fab") (width 0.1) (tstamp 9b7e1d00-3a14-436f-8022-ebef15b3b9f5))
(pad "A1" smd circle (at -1.225 -1.225) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 6a14386c-c2ac-43c7-9bf8-cedc37383b85))
(pad "A2" smd circle (at -0.875 -1.225) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp f9412125-0bac-4937-acb4-ad4196bfb843))
(pad "A3" smd circle (at -0.525 -1.225) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 92f34396-544f-4675-bcbf-22809b3f434d))
(pad "A4" smd circle (at -0.175 -1.225) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 7cce0d6e-6afb-47a2-9e7f-87b761907223))
(pad "A5" smd circle (at 0.175 -1.225) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp da179827-5002-48e6-8afe-39f10b2dabfa))
(pad "A6" smd circle (at 0.525 -1.225) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 713f318d-c504-4587-8e58-f4e667e94dd5))
(pad "A7" smd circle (at 0.875 -1.225) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 68dca5d5-5b50-4a72-9869-02e12da25e4a))
(pad "A8" smd circle (at 1.225 -1.225) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 9648e8be-9f1a-4661-a959-0c93d440f3be))
(pad "B1" smd circle (at -1.225 -0.875) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 45ddf5ef-18fd-4a9f-a805-a90f620f1376))
(pad "B2" smd circle (at -0.875 -0.875) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 1ee96bb5-d6ce-43e6-a214-18a5cb374661))
(pad "B3" smd circle (at -0.525 -0.875) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 733e35f4-154b-4517-af19-fcccce108e44))
(pad "B4" smd circle (at -0.175 -0.875) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 46841b73-586d-4e76-bffe-19853aabca43))
(pad "B5" smd circle (at 0.175 -0.875) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 1376ab51-91dd-4ef8-869e-5de0b66ae7f1))
(pad "B6" smd circle (at 0.525 -0.875) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 07b069ea-3882-45ac-b155-0588a310d3b9))
(pad "B7" smd circle (at 0.875 -0.875) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 6480c576-b1a0-49f4-86f6-b1b9aa042c85))
(pad "B8" smd circle (at 1.225 -0.875) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp bb423127-2d5e-44c2-87f5-4ce2cca42cc3))
(pad "C1" smd circle (at -1.225 -0.525) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp a27dcafa-4ef9-435a-a062-ab9705c01ea0))
(pad "C2" smd circle (at -0.875 -0.525) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp ec98b5ae-913d-45a7-a1bb-f3e110d6952f))
(pad "C3" smd circle (at -0.525 -0.525) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 95284eff-0af0-4aca-9b2f-286a60a64b83))
(pad "C4" smd circle (at -0.175 -0.525) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp ffa6df7b-ba04-4fdc-8544-4543322d8a5a))
(pad "C5" smd circle (at 0.175 -0.525) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 23303342-a891-48dc-89c2-ccc83a3a39a7))
(pad "C6" smd circle (at 0.525 -0.525) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 3c57d458-6a9a-4896-baaa-3178fac1aaaf))
(pad "C7" smd circle (at 0.875 -0.525) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp a763bb0c-d344-498e-8aed-69090f33b6d4))
(pad "C8" smd circle (at 1.225 -0.525) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 4b209e1b-b39b-49d1-ab70-0da808015047))
(pad "D1" smd circle (at -1.225 -0.175) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp acbaf33a-8f2d-4cd8-8ebf-e826e4634899))
(pad "D2" smd circle (at -0.875 -0.175) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 0d5790aa-a4a2-49e2-ac83-5f475cd7b8ca))
(pad "D3" smd circle (at -0.525 -0.175) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 02268734-160c-42e2-b674-11c44a099617))
(pad "D4" smd circle (at -0.175 -0.175) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 06a974c3-5115-40f2-b07d-c31944647014))
(pad "D5" smd circle (at 0.175 -0.175) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 6e46d416-636a-47f0-80aa-7e84248fc782))
(pad "D6" smd circle (at 0.525 -0.175) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 2a024fd7-5649-4c6c-b7ba-1eb2523f830e))
(pad "D7" smd circle (at 0.875 -0.175) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp dd2a5cfd-c188-44d7-ae8d-bf62649df0ae))
(pad "D8" smd circle (at 1.225 -0.175) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 9b95fab6-be04-4535-b650-a8dcb446582b))
(pad "E1" smd circle (at -1.225 0.175) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 96ed2510-b972-4cd3-9f6f-e70c6cfac6ae))
(pad "E2" smd circle (at -0.875 0.175) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 77d4b5c8-912e-4e28-ac2f-59231453d36f))
(pad "E3" smd circle (at -0.525 0.175) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp a4e7f26e-1947-43aa-bb33-45ad0bbc5677))
(pad "E4" smd circle (at -0.175 0.175) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 81cb4171-022a-418c-8561-558eac4ef051))
(pad "E5" smd circle (at 0.175 0.175) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp fda79b07-20c8-471c-8db4-a6deeb88bc1a))
(pad "E6" smd circle (at 0.525 0.175) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp c76519d1-a580-4d9d-a732-0bec70e92cc4))
(pad "E7" smd circle (at 0.875 0.175) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 0acaedba-6c7a-4fc2-b865-adb6a6a6b78d))
(pad "E8" smd circle (at 1.225 0.175) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 80702ecf-bddb-4368-ac0f-705695107072))
(pad "F1" smd circle (at -1.225 0.525) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp dd00cf3b-e4f1-4672-96c1-5a5a7c2b8b2b))
(pad "F2" smd circle (at -0.875 0.525) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp df9fc1db-d912-4042-8965-a9c2ccb7fd90))
(pad "F3" smd circle (at -0.525 0.525) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp c0a1e2d9-0785-40da-b3b1-227889f4120f))
(pad "F4" smd circle (at -0.175 0.525) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 3ab0219d-b6b1-4da2-a097-6d887f06b7f2))
(pad "F5" smd circle (at 0.175 0.525) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp c25970b3-2f9a-419c-a98d-fdd96d10a6d6))
(pad "F6" smd circle (at 0.525 0.525) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp a4e5b3e3-fe39-452a-834d-222f1e263109))
(pad "F7" smd circle (at 0.875 0.525) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 6e578a34-1c37-4c96-bf0d-b5ab16313482))
(pad "F8" smd circle (at 1.225 0.525) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 233c6e97-43ae-49a3-9ca7-8118a7e711c3))
(pad "G1" smd circle (at -1.225 0.875) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 1a484ad5-7b07-42a6-94e5-3a82e059421a))
(pad "G2" smd circle (at -0.875 0.875) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 72345d1c-7ec3-4a4f-bb58-4f3359445447))
(pad "G3" smd circle (at -0.525 0.875) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 39c4fc58-f790-4064-bbb0-8804cab757ff))
(pad "G4" smd circle (at -0.175 0.875) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp bd40f6c7-4910-4e61-ab32-a02a4fb46d60))
(pad "G5" smd circle (at 0.175 0.875) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 955aad3c-de64-4b7e-8e04-b2f92d238bae))
(pad "G6" smd circle (at 0.525 0.875) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 6d43075b-7c06-41d0-a008-36b116c7bd05))
(pad "G7" smd circle (at 0.875 0.875) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 113661d5-80e6-4b20-8025-e29abd347607))
(pad "G8" smd circle (at 1.225 0.875) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 16a76bec-f7e5-4476-b13f-9b99012f6d9e))
(pad "H1" smd circle (at -1.225 1.225) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 875d58e0-eb1a-40a6-86f1-0ef0c7684fdf))
(pad "H2" smd circle (at -0.875 1.225) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 71796289-4857-4242-8a5e-e8771f306067))
(pad "H3" smd circle (at -0.525 1.225) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 633274c5-c4d0-4add-83b8-5f03487d3586))
(pad "H4" smd circle (at -0.175 1.225) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 5cf0a249-bde8-47ce-9a2b-f0ea9b575ce3))
(pad "H5" smd circle (at 0.175 1.225) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 825687fe-f8a5-4d82-b433-ee2d105d5e5f))
(pad "H6" smd circle (at 0.525 1.225) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 170eae6f-c9a0-45d5-9b02-dfd1b120fc3e))
(pad "H7" smd circle (at 0.875 1.225) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp 548120e9-edb6-490e-b7f5-1bc872f566cc))
(pad "H8" smd circle (at 1.225 1.225) (size 0.21 0.21) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.059524) (tstamp f69ca509-b13f-4623-acd4-f57fd429b612))
(model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-64_Die435.wrl"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
|