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(footprint "ST_WLCSP-49_Die435" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 5AE11EAD)
(descr "WLCSP-49, 7x7 raster, 3.141x3.127mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/DM00257211.pdf")
(tags "BGA 49 0.4")
(attr smd)
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(effects (font (size 1 1) (thickness 0.15)))
(tstamp cb5d4b50-e989-48b6-ba5a-a4e1fa43e28b)
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(effects (font (size 1 1) (thickness 0.15)))
(tstamp 68ac1740-979f-4ad0-ad53-7d29be44a181)
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(fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
(effects (font (size 0.73 0.73) (thickness 0.1095)))
(tstamp fb51caa3-1af9-40ef-afab-1ebfd756d56c)
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(pad "D7" smd circle (at 1.2 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin_ratio 0.055556) (tstamp a0f84542-9eba-46eb-a08b-a54310d81278))
(pad "E1" smd circle (at -1.2 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "E2" smd circle (at -0.8 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "E3" smd circle (at -0.4 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "E4" smd circle (at 0 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "E5" smd circle (at 0.4 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "E6" smd circle (at 0.8 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-49_Die435.wrl"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
|
