library/kicadLibrary/footprints/Package_CSP.pretty/ST_WLCSP-180_Die451.kicad_mod


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(footprint "ST_WLCSP-180_Die451" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5AE11EAD)
  (descr "WLCSP-180, 13x14 raster, 5.537x6.095mm package, pitch 0.4mm; see section 6.6 of http://www.st.com/resource/en/datasheet/DM00273119.pdf")
  (tags "BGA 180 0.4")
  (attr smd)
  (fp_text reference "REF**" (at 0 -4.0475) (layer "F.SilkS")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 63dde1d7-b020-4c0d-85a0-9e962039707b)
  )
  (fp_text value "ST_WLCSP-180_Die451" (at 0 4.0475) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 20afeaf0-3eea-4c75-bcc6-5c8a39844f3f)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 67586c90-3e40-4fea-9dc2-6067fa2d53d7)
  )
  (fp_line (start -2.8935 3.1725) (end -2.8935 -2.1725) (layer "F.SilkS") (width 0.12) (tstamp 00c6283f-3b70-418d-8226-d74bb116b439))
  (fp_line (start 2.8935 3.1725) (end -2.8935 3.1725) (layer "F.SilkS") (width 0.12) (tstamp 0b69157c-df5d-4268-941b-664419428bad))
  (fp_line (start 2.8935 -3.1725) (end 2.8935 3.1725) (layer "F.SilkS") (width 0.12) (tstamp 1473ae70-223f-484c-b5e3-13faebb11d8f))
  (fp_line (start -1.8935 -3.1725) (end 2.8935 -3.1725) (layer "F.SilkS") (width 0.12) (tstamp 5cb8cac1-0d47-4c97-be98-c207ebc54942))
  (fp_line (start 3.77 -4.05) (end -3.77 -4.05) (layer "F.CrtYd") (width 0.05) (tstamp 2e63c8c9-f17b-4957-aae3-8cd3da156942))
  (fp_line (start 3.77 4.05) (end 3.77 -4.05) (layer "F.CrtYd") (width 0.05) (tstamp 60f5a660-1fed-4599-ac62-dac3a62f041f))
  (fp_line (start -3.77 -4.05) (end -3.77 4.05) (layer "F.CrtYd") (width 0.05) (tstamp 9fa90d6b-888a-4fce-a442-3922d51fbd50))
  (fp_line (start -3.77 4.05) (end 3.77 4.05) (layer "F.CrtYd") (width 0.05) (tstamp b6d3ede8-d4f0-4703-9a69-908d18229733))
  (fp_line (start -2.7685 3.0475) (end -2.7685 -2.0475) (layer "F.Fab") (width 0.1) (tstamp 04e51131-782a-49d7-8b75-d09ad582276e))
  (fp_line (start -1.7685 -3.0475) (end 2.7685 -3.0475) (layer "F.Fab") (width 0.1) (tstamp 11b9493b-a361-4b44-9544-0a8ed20f153c))
  (fp_line (start 2.7685 3.0475) (end -2.7685 3.0475) (layer "F.Fab") (width 0.1) (tstamp ac3f1514-a39d-4587-a8d6-5099d8fce190))
  (fp_line (start -2.7685 -2.0475) (end -1.7685 -3.0475) (layer "F.Fab") (width 0.1) (tstamp d01550af-8440-4d7b-b577-60b0a560143b))
  (fp_line (start 2.7685 -3.0475) (end 2.7685 3.0475) (layer "F.Fab") (width 0.1) (tstamp fd15676e-d0f9-4aa4-925d-963353dcec2f))
  (pad "A1" smd circle (at -2.4 -2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 1b840b92-1487-49ad-810b-924ffdc57154))
  (pad "A2" smd circle (at -2 -2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 99cc70c1-8263-42fa-8694-b357e5dd7351))
  (pad "A3" smd circle (at -1.6 -2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp ffc1183e-2f2f-4cd7-b892-0e000e574f7c))
  (pad "A4" smd circle (at -1.2 -2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp caecfc29-16af-43fd-a9f5-9252ad462a4f))
  (pad "A5" smd circle (at -0.8 -2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 33884162-bb4f-4884-9121-10371bdf196d))
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  (pad "A7" smd circle (at 0 -2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 48a747ed-b11e-4704-a685-c7144a291f64))
  (pad "A8" smd circle (at 0.4 -2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp f2b6cb1a-3922-4272-80f5-d4d4859ec5d0))
  (pad "A9" smd circle (at 0.8 -2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "A11" smd circle (at 1.6 -2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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    (solder_paste_margin_ratio 0.055556) (tstamp 8a512f42-6155-4ac2-b6ca-42247b23f7eb))
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    (solder_paste_margin_ratio 0.055556) (tstamp b9d6d257-dc20-440e-b79d-93bf8fbbefe8))
  (pad "B1" smd circle (at -2.4 -2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 9acb0679-1edb-4187-881d-937e9ec9ce88))
  (pad "B2" smd circle (at -2 -2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp dd9157f4-5b2b-456e-9cd7-a7f59255b2cc))
  (pad "B3" smd circle (at -1.6 -2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "B4" smd circle (at -1.2 -2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "B5" smd circle (at -0.8 -2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "B6" smd circle (at -0.4 -2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 62d866b6-1fdb-42ab-9e63-dbfef07ff65a))
  (pad "B7" smd circle (at 0 -2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp f81af153-9309-4cd6-b40b-45a9d05599e4))
  (pad "B8" smd circle (at 0.4 -2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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    (solder_paste_margin_ratio 0.055556) (tstamp f640cf76-c85a-464a-b04f-530f01ce7e94))
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  (pad "C4" smd circle (at -1.2 -1.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "C5" smd circle (at -0.8 -1.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp c48ee2c4-b7f0-4443-b044-25cfcf6b898c))
  (pad "C6" smd circle (at -0.4 -1.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "C7" smd circle (at 0 -1.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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    (solder_paste_margin_ratio 0.055556) (tstamp 10a775ed-d6f3-48cb-8661-e3909af57f27))
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    (solder_paste_margin_ratio 0.055556) (tstamp 075037b2-c792-4aa0-a7e6-e43309b65b42))
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    (solder_paste_margin_ratio 0.055556) (tstamp 7408b513-78f9-404f-975e-87c6ff8a681c))
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    (solder_paste_margin_ratio 0.055556) (tstamp 60a008b7-a2cd-4afa-8a29-874f42b22662))
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    (solder_paste_margin_ratio 0.055556) (tstamp 2bd4333e-0356-4708-933f-58df98e5b81a))
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    (solder_paste_margin_ratio 0.055556) (tstamp 59fac91d-55c9-4ce2-b01e-5eb8d2ee46bf))
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    (solder_paste_margin_ratio 0.055556) (tstamp cef5941f-076a-4525-9e81-4c3651324d08))
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    (solder_paste_margin_ratio 0.055556) (tstamp 4c96fe6c-9fd7-4010-b9ce-de2f07bcb9d1))
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    (solder_paste_margin_ratio 0.055556) (tstamp 384547f1-d311-4527-842e-fb8b384415b8))
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    (solder_paste_margin_ratio 0.055556) (tstamp 9084abcf-0567-4610-8163-8d3cbcdaedfe))
  (pad "M13" smd circle (at 2.4 1.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp f821b79d-7d59-43b5-800d-1e3f1f4c8706))
  (pad "N1" smd circle (at -2.4 2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp f6a464a0-1a98-43ae-b92e-5e7bc3c8da6f))
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    (solder_paste_margin_ratio 0.055556) (tstamp 030b0e3a-e942-4f3b-8e5f-aa8f7cb0594d))
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    (solder_paste_margin_ratio 0.055556) (tstamp e647fb8f-a83d-4cf1-8272-cf0dbed578f1))
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    (solder_paste_margin_ratio 0.055556) (tstamp e1ed9bee-16f8-4e5e-b308-fc50bdc9bf4b))
  (pad "N5" smd circle (at -0.8 2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp ef89424a-bd11-460e-a430-fd71abb65f46))
  (pad "N6" smd circle (at -0.4 2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 48cccbf6-2d8d-4a7f-a34b-f9e923469671))
  (pad "N7" smd circle (at 0 2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 13c5546f-b29f-4406-b36f-a5b160e818c3))
  (pad "N8" smd circle (at 0.4 2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp e2dc2d82-dc8d-4055-adf9-34d9a76a2115))
  (pad "N9" smd circle (at 0.8 2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 5e3a3b02-07e4-430b-98c5-c768bfd1539b))
  (pad "N10" smd circle (at 1.2 2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp f5092b8c-8263-40fc-92ec-037c4fd2df93))
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    (solder_paste_margin_ratio 0.055556) (tstamp 74681f3a-ae27-437a-81e2-01ed3f7c0273))
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    (solder_paste_margin_ratio 0.055556) (tstamp 7c1a5f84-0a5f-4145-82cc-3294bb9147c7))
  (pad "N13" smd circle (at 2.4 2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 0e7b4553-6429-4d55-8b65-e631233fb4c0))
  (pad "P1" smd circle (at -2.4 2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 3d5055fd-56e4-4ea6-b7a5-5eece32d0863))
  (pad "P2" smd circle (at -2 2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp dc939f2b-9e4c-43b9-860d-06c70c91b3db))
  (pad "P3" smd circle (at -1.6 2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp e70a04b9-7823-4cbb-acb2-1ecf6a1869f4))
  (pad "P4" smd circle (at -1.2 2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 291c160f-efa3-42dd-882f-c4abb890dc7c))
  (pad "P5" smd circle (at -0.8 2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 47e1c562-b402-42c3-903b-c5042ff5198d))
  (pad "P6" smd circle (at -0.4 2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 6ba22c24-936c-4d3a-b6a1-991fc90fe2fb))
  (pad "P7" smd circle (at 0 2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 1b13a0c3-43b8-4b71-bc50-8dba256a3a9a))
  (pad "P8" smd circle (at 0.4 2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 8712d338-5521-4099-831d-65831deea2ab))
  (pad "P9" smd circle (at 0.8 2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 351a13f6-d696-481b-ac9e-6561ddfa8111))
  (pad "P10" smd circle (at 1.2 2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 2b43a5e8-2140-46bf-b3cb-52d22952bb17))
  (pad "P11" smd circle (at 1.6 2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp c1628d44-58ee-4f26-bd5f-fe96c84cb49f))
  (pad "P12" smd circle (at 2 2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 0579f813-3c54-4389-b1cc-7f26a0041938))
  (pad "P13" smd circle (at 2.4 2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 7ef19716-8188-4fad-b06f-c397f3e3ccff))
  (model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-180_Die451.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)