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(footprint "ST_WLCSP-144_Die470" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5AE11EAD)
  (descr "WLCSP-144, 12x12 raster, 5.24x5.24mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/DM00366448.pdf")
  (tags "BGA 144 0.4")
  (attr smd)
  (fp_text reference "REF**" (at 0 -3.62) (layer "F.SilkS")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 1df7a3b7-dd3d-46e8-8615-8bac4668e7fc)
  )
  (fp_text value "ST_WLCSP-144_Die470" (at 0 3.62) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 9bf61156-09fd-48c2-9dcf-43af98a79076)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 0ff86bed-8b6f-4244-b131-200e9ea6adbd)
  )
  (fp_line (start -1.745 -2.745) (end 2.745 -2.745) (layer "F.SilkS") (width 0.12) (tstamp 5f3db50b-0a84-4125-aed6-b4fb0f05ed6b))
  (fp_line (start -2.745 2.745) (end -2.745 -1.745) (layer "F.SilkS") (width 0.12) (tstamp c5ece89e-1e7d-4e49-b9f5-1e0ade47c7ce))
  (fp_line (start 2.745 -2.745) (end 2.745 2.745) (layer "F.SilkS") (width 0.12) (tstamp d4aa2d0a-12fa-4034-ab92-17d69e523bf5))
  (fp_line (start 2.745 2.745) (end -2.745 2.745) (layer "F.SilkS") (width 0.12) (tstamp f38a0463-4948-4c5b-a47b-275ea2ba092d))
  (fp_line (start -3.62 -3.62) (end -3.62 3.62) (layer "F.CrtYd") (width 0.05) (tstamp 2eecbb86-bbbc-4fc2-8539-cf670d6c0acb))
  (fp_line (start 3.62 -3.62) (end -3.62 -3.62) (layer "F.CrtYd") (width 0.05) (tstamp aeb49c12-8393-4846-9b11-e6ec367db62d))
  (fp_line (start -3.62 3.62) (end 3.62 3.62) (layer "F.CrtYd") (width 0.05) (tstamp d69d2e33-b32d-4898-aa6c-2e73cd0126bf))
  (fp_line (start 3.62 3.62) (end 3.62 -3.62) (layer "F.CrtYd") (width 0.05) (tstamp de8b24c6-863a-4e02-a85c-bddeb3b9ff61))
  (fp_line (start -2.62 2.62) (end -2.62 -1.62) (layer "F.Fab") (width 0.1) (tstamp 0bbe7b8d-27d7-41e9-a646-79322fb4c8e5))
  (fp_line (start 2.62 2.62) (end -2.62 2.62) (layer "F.Fab") (width 0.1) (tstamp 43bb36d6-77df-41ab-b4ae-c422cf62f9d1))
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  (fp_line (start 2.62 -2.62) (end 2.62 2.62) (layer "F.Fab") (width 0.1) (tstamp bc3253af-65b0-4842-904f-a75b7e25ee6d))
  (pad "A1" smd circle (at -2.2 -2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 3e6ccf06-59e8-4c7d-bc75-adc39fac659d))
  (pad "A2" smd circle (at -1.8 -2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 3a32e28c-691d-4d25-9a03-45796c63228c))
  (pad "A3" smd circle (at -1.4 -2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp c5d5e7e1-b8f1-4cf7-8c46-d046e9d23cde))
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    (solder_paste_margin_ratio 0.055556) (tstamp 7e5c9431-98bd-49da-baf4-91aa18a30f5e))
  (pad "A5" smd circle (at -0.6 -2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp cf8f536b-2e8e-454c-8c98-774db8c727fb))
  (pad "A6" smd circle (at -0.2 -2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 9b2245d4-9f57-47c1-b3b7-c7cb407be857))
  (pad "A7" smd circle (at 0.2 -2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 212dca74-8160-4ec7-bc57-3c1326956f54))
  (pad "A8" smd circle (at 0.6 -2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 4490ae57-f33b-4141-8fed-ef6617e6be79))
  (pad "A9" smd circle (at 1 -2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 5001d177-131e-4686-b9d4-41f3b23d16e9))
  (pad "A10" smd circle (at 1.4 -2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "A11" smd circle (at 1.8 -2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 68fff52f-328d-445d-ade4-39613958b796))
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    (solder_paste_margin_ratio 0.055556) (tstamp b6d0e7ca-c1f9-451c-a947-605624c1c17b))
  (pad "B1" smd circle (at -2.2 -1.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 4b63f397-6def-4c51-a295-227e3882188c))
  (pad "B2" smd circle (at -1.8 -1.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 5d27a5d1-368f-4ade-8839-8b9f2eb82614))
  (pad "B3" smd circle (at -1.4 -1.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 97621689-da90-482f-8144-5dcbbca9d1ce))
  (pad "B4" smd circle (at -1 -1.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp e383edd0-eaff-43b9-836f-ec311133d125))
  (pad "B5" smd circle (at -0.6 -1.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 61eb86eb-0fff-41e8-a3c2-08a95e9c428e))
  (pad "B6" smd circle (at -0.2 -1.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 982e4067-b7a0-4fac-b93e-37bd845e3d62))
  (pad "B7" smd circle (at 0.2 -1.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 25129f42-2ea5-4bdb-a90c-628a440fdee0))
  (pad "B8" smd circle (at 0.6 -1.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp b754828c-1c8c-4be8-bd2c-9507b2182bd1))
  (pad "B9" smd circle (at 1 -1.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 504038e8-aa4e-4d65-8ae2-5271fc1031b9))
  (pad "B10" smd circle (at 1.4 -1.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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    (solder_paste_margin_ratio 0.055556) (tstamp 3bdfaaad-aa1f-4ac2-9cab-124e8582abe3))
  (pad "C1" smd circle (at -2.2 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 6d43a388-fdf8-4613-9f32-4351a9c2a74f))
  (pad "C2" smd circle (at -1.8 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "C5" smd circle (at -0.6 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 794e4672-50f3-4461-a266-485ebcde73e8))
  (pad "C6" smd circle (at -0.2 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "C7" smd circle (at 0.2 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "C8" smd circle (at 0.6 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "C9" smd circle (at 1 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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  (model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-144_Die470.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)