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|
(footprint "ST_WLCSP-143_Die449" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 5AE11EAD)
(descr "WLCSP-143, 11x13 raster, 4.539x5.849mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf")
(tags "BGA 143 0.4")
(attr smd)
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(pad "N9" smd circle (at 1.2 2.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "N11" smd circle (at 2 2.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-143_Die449.wrl"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
|
