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authorPSR00012023-06-18 09:10:00 +0530
committerPSR00012023-06-18 09:10:00 +0530
commit5677d6b61acff4f2f4b3c752fe51f9b8350fb14a (patch)
tree74e2437a43bb50652f329e6c03924afbbe1d5286 /library/kicadLibrary/modules/Housings_SOIC.pretty/TI_SO-PowerPAD-8.kicad_mod
parentb4466912da566a52c902e81c59d3ab0f08154814 (diff)
downloadeSim-5677d6b61acff4f2f4b3c752fe51f9b8350fb14a.tar.gz
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Update libries for KiCad V6
Diffstat (limited to 'library/kicadLibrary/modules/Housings_SOIC.pretty/TI_SO-PowerPAD-8.kicad_mod')
-rw-r--r--library/kicadLibrary/modules/Housings_SOIC.pretty/TI_SO-PowerPAD-8.kicad_mod51
1 files changed, 0 insertions, 51 deletions
diff --git a/library/kicadLibrary/modules/Housings_SOIC.pretty/TI_SO-PowerPAD-8.kicad_mod b/library/kicadLibrary/modules/Housings_SOIC.pretty/TI_SO-PowerPAD-8.kicad_mod
deleted file mode 100644
index c51e03ce..00000000
--- a/library/kicadLibrary/modules/Housings_SOIC.pretty/TI_SO-PowerPAD-8.kicad_mod
+++ /dev/null
@@ -1,51 +0,0 @@
-(module TI_SO-PowerPAD-8 (layer F.Cu) (tedit 594A9ED3)
- (descr "8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf)")
- (tags "SSOP 0.50 exposed pad")
- (attr smd)
- (fp_text reference REF** (at 0 -3.3) (layer F.SilkS)
- (effects (font (size 1 1) (thickness 0.15)))
- )
- (fp_text value TI_SO-PowerPAD-8 (at 0 3.4) (layer F.Fab)
- (effects (font (size 1 1) (thickness 0.15)))
- )
- (fp_line (start -0.95 -2.45) (end 1.95 -2.45) (layer F.Fab) (width 0.15))
- (fp_line (start 1.95 -2.45) (end 1.95 2.45) (layer F.Fab) (width 0.15))
- (fp_line (start 1.95 2.45) (end -1.95 2.45) (layer F.Fab) (width 0.15))
- (fp_line (start -1.95 2.45) (end -1.95 -1.45) (layer F.Fab) (width 0.15))
- (fp_line (start -1.95 -1.45) (end -0.95 -2.45) (layer F.Fab) (width 0.15))
- (fp_line (start -4 -2.7) (end -4 2.7) (layer F.CrtYd) (width 0.05))
- (fp_line (start 4 -2.7) (end 4 2.7) (layer F.CrtYd) (width 0.05))
- (fp_line (start -4 -2.7) (end 4 -2.7) (layer F.CrtYd) (width 0.05))
- (fp_line (start -4 2.7) (end 4 2.7) (layer F.CrtYd) (width 0.05))
- (fp_line (start -2.075 -2.575) (end -2.075 -2.375) (layer F.SilkS) (width 0.15))
- (fp_line (start 2.075 -2.575) (end 2.075 -2.375) (layer F.SilkS) (width 0.15))
- (fp_line (start 2.075 2.575) (end 2.075 2.375) (layer F.SilkS) (width 0.15))
- (fp_line (start -2.075 2.575) (end -2.075 2.375) (layer F.SilkS) (width 0.15))
- (fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
- (fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
- (fp_line (start -2.075 -2.375) (end -3.375 -2.375) (layer F.SilkS) (width 0.15))
- (fp_text user %R (at 0 0) (layer F.Fab)
- (effects (font (size 1 1) (thickness 0.15)))
- )
- (pad 1 smd rect (at -2.78 -1.905) (size 1.91 0.61) (layers F.Cu F.Paste F.Mask))
- (pad 2 smd rect (at -2.78 -0.635) (size 1.91 0.61) (layers F.Cu F.Paste F.Mask))
- (pad 3 smd rect (at -2.78 0.635) (size 1.91 0.61) (layers F.Cu F.Paste F.Mask))
- (pad 4 smd rect (at -2.78 1.905) (size 1.91 0.61) (layers F.Cu F.Paste F.Mask))
- (pad 5 smd rect (at 2.78 1.905) (size 1.91 0.61) (layers F.Cu F.Paste F.Mask))
- (pad 6 smd rect (at 2.78 0.635) (size 1.91 0.61) (layers F.Cu F.Paste F.Mask))
- (pad 7 smd rect (at 2.78 -0.635) (size 1.91 0.61) (layers F.Cu F.Paste F.Mask))
- (pad 8 smd rect (at 2.78 -1.905) (size 1.91 0.61) (layers F.Cu F.Paste F.Mask))
- (pad 9 smd rect (at 0.6025 0.775) (size 1.205 1.55) (layers F.Cu F.Paste F.Mask)
- (solder_paste_margin_ratio -0.2))
- (pad 9 smd rect (at 0.6025 -0.775) (size 1.205 1.55) (layers F.Cu F.Paste F.Mask)
- (solder_paste_margin_ratio -0.2))
- (pad 9 smd rect (at -0.6025 0.775) (size 1.205 1.55) (layers F.Cu F.Paste F.Mask)
- (solder_paste_margin_ratio -0.2))
- (pad 9 smd rect (at -0.6025 -0.775) (size 1.205 1.55) (layers F.Cu F.Paste F.Mask)
- (solder_paste_margin_ratio -0.2))
- (model ${KISYS3DMOD}/Housings_SOIC.3dshapes/TI_SO-PowerPAD-8.wrl
- (at (xyz 0 0 0))
- (scale (xyz 1 1 1))
- (rotate (xyz 0 0 0))
- )
-)