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Diffstat (limited to '587/CH3/EX3.5')
-rwxr-xr-x | 587/CH3/EX3.5/example3_5.sce | 24 |
1 files changed, 24 insertions, 0 deletions
diff --git a/587/CH3/EX3.5/example3_5.sce b/587/CH3/EX3.5/example3_5.sce new file mode 100755 index 000000000..4503d02ba --- /dev/null +++ b/587/CH3/EX3.5/example3_5.sce @@ -0,0 +1,24 @@ +clear;
+clc;
+
+//Example3.5[Contact Reistance of Transistors]
+//Given:-
+k=386;//Thermal Conductivity of Copper[W/m.K]
+hc=42000;//Contact Conductance coreesponding to copper-aluminium interface for the case of 1.17-1.4 micron roughness and 5MPa[pressure, which is close to given to what we have[W/m^2.K]
+Ac=.0008;//Contact area b/w the case and the plate[m^2]
+A=0.01;//Plate area for each resistor[m^2]
+L=0.01;//Thickness of plate[m]
+ho=25;//Heat tranfer coefficient for back surface
+T_1=20;//Ambient Temperature[degree Celcius]
+T_2=70;//Maximum temperature of case[degree Celcius]
+//Solution:-
+//Resistances Offered
+R_interface=1/(hc*Ac);//Resistance offered at the copper aluminium interface[degree Cecius/W]
+R_plate=L/(k*A);//conduction resistance offered by coppr plate[degree Cecius/W]
+R_conv=1/(ho*A);//Convection resistance offerd by back surface of casing[degree Cecius/W]
+R_total=R_interface+R_plate+R_conv;//[degree Cecius/W]
+disp("degree Cecius/W",R_total,"The total thermal Tesistance is")
+Q_=(T_2-T_1)/R_total;//[W]
+disp("W",Q_,"The rate of heat transferred is")
+delta_T=Q_*R_interface;//[degree Celcius]
+disp("degree Celcius",delta_T,"The temperature jump at the interface is given by")
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