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+// Display mode
+mode(0);
+// Display warning for floating point exception
+ieee(1);
+clear;
+clc;
+disp("Introduction to heat transfer by S.K.Som, Chapter 5, Example 4")
+//Air at atmospheric pressure is required to flow over a circuit board to cool the electronics element mounted on it.
+//Chip has length (L)=3mm and width(B)=3mm located x=0.1m from the leading edge
+L=0.003;//in metre
+B=0.003;//in metre
+x=0.1;
+//The Nusselt no. is given by Nux=0.06*Rex^0.85*Pr^0.33
+//The chip has to dissipate E=50mW of energy while its surface temprature has to be kept below temprature,Ts=45°C and free strem Temptrature of air is Tinf=25°C
+Ts=45;
+Tinf=25;
+E=50*10^-3;//in watt
+//For air ,density(rho=1.2kg/m^3),viscosity(mu=1.8*10^5kg/(m*s)),conductivity(k=0.03W/(m*K)) and specific heat(cp=1000J/(kg*K))
+rho=1.2;
+mu=1.8*10^5;
+k=0.03;
+cp=1000;
+//Let the minimum flow velocity be U.
+//The local heat transfer coefficient hx where the chip is mounted is determined as hx=(k/x)*0.06*(rho*U*x/mu)^0.85*(mu*cp/k)^0.33
+disp("The local heat transfer coefficient hx is hx=27.063*U^0.85")
+//from an enrgy balance we can write 27.063*U^0.85*L*B*(Ts-Tinf)=E
+disp("The minimum flow velocity in m/s is")
+U=[E/(27.063*L*B*(Ts-Tinf))]^(1/0.85)
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