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+Generic Thermal Sysfs driver How To
+===================================
+
+Written by Sujith Thomas <sujith.thomas@intel.com>, Zhang Rui <rui.zhang@intel.com>
+
+Updated: 2 January 2008
+
+Copyright (c) 2008 Intel Corporation
+
+
+0. Introduction
+
+The generic thermal sysfs provides a set of interfaces for thermal zone
+devices (sensors) and thermal cooling devices (fan, processor...) to register
+with the thermal management solution and to be a part of it.
+
+This how-to focuses on enabling new thermal zone and cooling devices to
+participate in thermal management.
+This solution is platform independent and any type of thermal zone devices
+and cooling devices should be able to make use of the infrastructure.
+
+The main task of the thermal sysfs driver is to expose thermal zone attributes
+as well as cooling device attributes to the user space.
+An intelligent thermal management application can make decisions based on
+inputs from thermal zone attributes (the current temperature and trip point
+temperature) and throttle appropriate devices.
+
+[0-*] denotes any positive number starting from 0
+[1-*] denotes any positive number starting from 1
+
+1. thermal sysfs driver interface functions
+
+1.1 thermal zone device interface
+1.1.1 struct thermal_zone_device *thermal_zone_device_register(char *name,
+ int trips, void *devdata, struct thermal_zone_device_ops *ops)
+
+ This interface function adds a new thermal zone device (sensor) to
+ /sys/class/thermal folder as thermal_zone[0-*]. It tries to bind all the
+ thermal cooling devices registered at the same time.
+
+ name: the thermal zone name.
+ trips: the total number of trip points this thermal zone supports.
+ devdata: device private data
+ ops: thermal zone device call-backs.
+ .bind: bind the thermal zone device with a thermal cooling device.
+ .unbind: unbind the thermal zone device with a thermal cooling device.
+ .get_temp: get the current temperature of the thermal zone.
+ .get_mode: get the current mode (user/kernel) of the thermal zone.
+ - "kernel" means thermal management is done in kernel.
+ - "user" will prevent kernel thermal driver actions upon trip points
+ so that user applications can take charge of thermal management.
+ .set_mode: set the mode (user/kernel) of the thermal zone.
+ .get_trip_type: get the type of certain trip point.
+ .get_trip_temp: get the temperature above which the certain trip point
+ will be fired.
+
+1.1.2 void thermal_zone_device_unregister(struct thermal_zone_device *tz)
+
+ This interface function removes the thermal zone device.
+ It deletes the corresponding entry form /sys/class/thermal folder and
+ unbind all the thermal cooling devices it uses.
+
+1.2 thermal cooling device interface
+1.2.1 struct thermal_cooling_device *thermal_cooling_device_register(char *name,
+ void *devdata, struct thermal_cooling_device_ops *)
+
+ This interface function adds a new thermal cooling device (fan/processor/...)
+ to /sys/class/thermal/ folder as cooling_device[0-*]. It tries to bind itself
+ to all the thermal zone devices register at the same time.
+ name: the cooling device name.
+ devdata: device private data.
+ ops: thermal cooling devices call-backs.
+ .get_max_state: get the Maximum throttle state of the cooling device.
+ .get_cur_state: get the Current throttle state of the cooling device.
+ .set_cur_state: set the Current throttle state of the cooling device.
+
+1.2.2 void thermal_cooling_device_unregister(struct thermal_cooling_device *cdev)
+
+ This interface function remove the thermal cooling device.
+ It deletes the corresponding entry form /sys/class/thermal folder and
+ unbind itself from all the thermal zone devices using it.
+
+1.3 interface for binding a thermal zone device with a thermal cooling device
+1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,
+ int trip, struct thermal_cooling_device *cdev);
+
+ This interface function bind a thermal cooling device to the certain trip
+ point of a thermal zone device.
+ This function is usually called in the thermal zone device .bind callback.
+ tz: the thermal zone device
+ cdev: thermal cooling device
+ trip: indicates which trip point the cooling devices is associated with
+ in this thermal zone.
+
+1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz,
+ int trip, struct thermal_cooling_device *cdev);
+
+ This interface function unbind a thermal cooling device from the certain
+ trip point of a thermal zone device. This function is usually called in
+ the thermal zone device .unbind callback.
+ tz: the thermal zone device
+ cdev: thermal cooling device
+ trip: indicates which trip point the cooling devices is associated with
+ in this thermal zone.
+
+2. sysfs attributes structure
+
+RO read only value
+RW read/write value
+
+Thermal sysfs attributes will be represented under /sys/class/thermal.
+Hwmon sysfs I/F extension is also available under /sys/class/hwmon
+if hwmon is compiled in or built as a module.
+
+Thermal zone device sys I/F, created once it's registered:
+/sys/class/thermal/thermal_zone[0-*]:
+ |---type: Type of the thermal zone
+ |---temp: Current temperature
+ |---mode: Working mode of the thermal zone
+ |---trip_point_[0-*]_temp: Trip point temperature
+ |---trip_point_[0-*]_type: Trip point type
+
+Thermal cooling device sys I/F, created once it's registered:
+/sys/class/thermal/cooling_device[0-*]:
+ |---type: Type of the cooling device(processor/fan/...)
+ |---max_state: Maximum cooling state of the cooling device
+ |---cur_state: Current cooling state of the cooling device
+
+
+Then next two dynamic attributes are created/removed in pairs. They represent
+the relationship between a thermal zone and its associated cooling device.
+They are created/removed for each successful execution of
+thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device.
+
+/sys/class/thermal/thermal_zone[0-*]:
+ |---cdev[0-*]: [0-*]th cooling device in current thermal zone
+ |---cdev[0-*]_trip_point: Trip point that cdev[0-*] is associated with
+
+Besides the thermal zone device sysfs I/F and cooling device sysfs I/F,
+the generic thermal driver also creates a hwmon sysfs I/F for each _type_
+of thermal zone device. E.g. the generic thermal driver registers one hwmon
+class device and build the associated hwmon sysfs I/F for all the registered
+ACPI thermal zones.
+
+/sys/class/hwmon/hwmon[0-*]:
+ |---name: The type of the thermal zone devices
+ |---temp[1-*]_input: The current temperature of thermal zone [1-*]
+ |---temp[1-*]_critical: The critical trip point of thermal zone [1-*]
+
+Please read Documentation/hwmon/sysfs-interface for additional information.
+
+***************************
+* Thermal zone attributes *
+***************************
+
+type
+ Strings which represent the thermal zone type.
+ This is given by thermal zone driver as part of registration.
+ E.g: "acpitz" indicates it's an ACPI thermal device.
+ In order to keep it consistent with hwmon sys attribute; this should
+ be a short, lowercase string, not containing spaces nor dashes.
+ RO, Required
+
+temp
+ Current temperature as reported by thermal zone (sensor).
+ Unit: millidegree Celsius
+ RO, Required
+
+mode
+ One of the predefined values in [kernel, user].
+ This file gives information about the algorithm that is currently
+ managing the thermal zone. It can be either default kernel based
+ algorithm or user space application.
+ kernel = Thermal management in kernel thermal zone driver.
+ user = Preventing kernel thermal zone driver actions upon
+ trip points so that user application can take full
+ charge of the thermal management.
+ RW, Optional
+
+trip_point_[0-*]_temp
+ The temperature above which trip point will be fired.
+ Unit: millidegree Celsius
+ RO, Optional
+
+trip_point_[0-*]_type
+ Strings which indicate the type of the trip point.
+ E.g. it can be one of critical, hot, passive, active[0-*] for ACPI
+ thermal zone.
+ RO, Optional
+
+cdev[0-*]
+ Sysfs link to the thermal cooling device node where the sys I/F
+ for cooling device throttling control represents.
+ RO, Optional
+
+cdev[0-*]_trip_point
+ The trip point with which cdev[0-*] is associated in this thermal
+ zone; -1 means the cooling device is not associated with any trip
+ point.
+ RO, Optional
+
+passive
+ Attribute is only present for zones in which the passive cooling
+ policy is not supported by native thermal driver. Default is zero
+ and can be set to a temperature (in millidegrees) to enable a
+ passive trip point for the zone. Activation is done by polling with
+ an interval of 1 second.
+ Unit: millidegrees Celsius
+ Valid values: 0 (disabled) or greater than 1000
+ RW, Optional
+
+*****************************
+* Cooling device attributes *
+*****************************
+
+type
+ String which represents the type of device, e.g:
+ - for generic ACPI: should be "Fan", "Processor" or "LCD"
+ - for memory controller device on intel_menlow platform:
+ should be "Memory controller".
+ RO, Required
+
+max_state
+ The maximum permissible cooling state of this cooling device.
+ RO, Required
+
+cur_state
+ The current cooling state of this cooling device.
+ The value can any integer numbers between 0 and max_state:
+ - cur_state == 0 means no cooling
+ - cur_state == max_state means the maximum cooling.
+ RW, Required
+
+3. A simple implementation
+
+ACPI thermal zone may support multiple trip points like critical, hot,
+passive, active. If an ACPI thermal zone supports critical, passive,
+active[0] and active[1] at the same time, it may register itself as a
+thermal_zone_device (thermal_zone1) with 4 trip points in all.
+It has one processor and one fan, which are both registered as
+thermal_cooling_device.
+
+If the processor is listed in _PSL method, and the fan is listed in _AL0
+method, the sys I/F structure will be built like this:
+
+/sys/class/thermal:
+
+|thermal_zone1:
+ |---type: acpitz
+ |---temp: 37000
+ |---mode: kernel
+ |---trip_point_0_temp: 100000
+ |---trip_point_0_type: critical
+ |---trip_point_1_temp: 80000
+ |---trip_point_1_type: passive
+ |---trip_point_2_temp: 70000
+ |---trip_point_2_type: active0
+ |---trip_point_3_temp: 60000
+ |---trip_point_3_type: active1
+ |---cdev0: --->/sys/class/thermal/cooling_device0
+ |---cdev0_trip_point: 1 /* cdev0 can be used for passive */
+ |---cdev1: --->/sys/class/thermal/cooling_device3
+ |---cdev1_trip_point: 2 /* cdev1 can be used for active[0]*/
+
+|cooling_device0:
+ |---type: Processor
+ |---max_state: 8
+ |---cur_state: 0
+
+|cooling_device3:
+ |---type: Fan
+ |---max_state: 2
+ |---cur_state: 0
+
+/sys/class/hwmon:
+
+|hwmon0:
+ |---name: acpitz
+ |---temp1_input: 37000
+ |---temp1_crit: 100000
+
+4. Event Notification
+
+The framework includes a simple notification mechanism, in the form of a
+netlink event. Netlink socket initialization is done during the _init_
+of the framework. Drivers which intend to use the notification mechanism
+just need to call thermal_generate_netlink_event() with two arguments viz
+(originator, event). Typically the originator will be an integer assigned
+to a thermal_zone_device when it registers itself with the framework. The
+event will be one of:{THERMAL_AUX0, THERMAL_AUX1, THERMAL_CRITICAL,
+THERMAL_DEV_FAULT}. Notification can be sent when the current temperature
+crosses any of the configured thresholds.