(module Microchip_8E-16 (layer F.Cu) (tedit 5939F255)
  (descr "16-Lead Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "QFN Microchip 8E 16")
  (solder_mask_margin 0.1)
  (attr smd)
  (fp_text reference REF** (at 0 -3.1) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value Microchip_8E-16 (at 0 3.1) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start -2 2) (end -2 -1) (layer F.Fab) (width 0.1))
  (fp_line (start 2 2) (end -2 2) (layer F.Fab) (width 0.1))
  (fp_line (start 2 -2) (end 2 2) (layer F.Fab) (width 0.1))
  (fp_line (start -1 -2) (end 2 -2) (layer F.Fab) (width 0.1))
  (fp_line (start -2.5 -2.5) (end -2.5 2.5) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.5 -2.5) (end 2.5 2.5) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.5 -2.5) (end 2.5 -2.5) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.5 2.5) (end 2.5 2.5) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.175 -2.175) (end 2.175 -1.375) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.175 2.175) (end -2.175 1.375) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.175 2.175) (end 2.175 1.375) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.175 -2.175) (end -1.375 -2.175) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.175 2.175) (end -1.375 2.175) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.175 2.175) (end 1.375 2.175) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.175 -2.175) (end 1.375 -2.175) (layer F.SilkS) (width 0.15))
  (fp_line (start -1 -2) (end -2 -1) (layer F.Fab) (width 0.1))
  (fp_text user %R (at 0 0) (layer F.Fab)
    (effects (font (size 0.8 0.8) (thickness 0.15)))
  )
  (pad 1 smd rect (at -1.8125 -0.975) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -1.8125 -0.325) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -1.8125 0.325) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -1.8125 0.975) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at -0.975 1.8125 90) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at -0.325 1.8125 90) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at 0.325 1.8125 90) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at 0.975 1.8125 90) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at 1.8125 0.975) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd rect (at 1.8125 0.325) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 11 smd rect (at 1.8125 -0.325) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 12 smd rect (at 1.8125 -0.975) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 13 smd rect (at 0.975 -1.8125 90) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 14 smd rect (at 0.325 -1.8125 90) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 15 smd rect (at -0.325 -1.8125 90) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 16 smd rect (at -0.975 -1.8125 90) (size 0.725 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 17 smd rect (at 0.5375 0.5375) (size 1.075 1.075) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 17 smd rect (at 0.5375 -0.5375) (size 1.075 1.075) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 17 smd rect (at -0.5375 0.5375) (size 1.075 1.075) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 17 smd rect (at -0.5375 -0.5375) (size 1.075 1.075) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (model ${KISYS3DMOD}/Housings_DFN_QFN.3dshapes/QFN-16-1EP_4x4mm_Pitch0.65mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)