(module LFCSP-16-1EP_3x3mm_Pitch0.5mm (layer F.Cu) (tedit 597F50A7) (descr "16-Lead Lead Frame Chip Scale Package, 3x3mm, 0.5mm pitch, 1.854mm thermal pad (CP-16-22, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_22.pdf)") (tags "LFCSP 16 0.5") (attr smd) (fp_text reference REF** (at 0 -2.85) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value LFCSP-16-1EP_3x3mm_Pitch0.5mm (at 0 2.85) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text user %R (at 0 0) (layer F.Fab) (effects (font (size 0.7 0.7) (thickness 0.15))) ) (fp_line (start -0.5 -1.5) (end 1.5 -1.5) (layer F.Fab) (width 0.15)) (fp_line (start 1.5 -1.5) (end 1.5 1.5) (layer F.Fab) (width 0.15)) (fp_line (start 1.5 1.5) (end -1.5 1.5) (layer F.Fab) (width 0.15)) (fp_line (start -1.5 1.5) (end -1.5 -0.5) (layer F.Fab) (width 0.15)) (fp_line (start -1.5 -0.5) (end -0.5 -1.5) (layer F.Fab) (width 0.15)) (fp_line (start -2.1 -2.1) (end -2.1 2.1) (layer F.CrtYd) (width 0.05)) (fp_line (start 2.1 -2.1) (end 2.1 2.1) (layer F.CrtYd) (width 0.05)) (fp_line (start -2.1 -2.1) (end 2.1 -2.1) (layer F.CrtYd) (width 0.05)) (fp_line (start -2.1 2.1) (end 2.1 2.1) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.625 -1.625) (end 1.625 -1.125) (layer F.SilkS) (width 0.15)) (fp_line (start -1.625 1.625) (end -1.625 1.125) (layer F.SilkS) (width 0.15)) (fp_line (start 1.625 1.625) (end 1.625 1.125) (layer F.SilkS) (width 0.15)) (fp_line (start -1.625 -1.625) (end -1.125 -1.625) (layer F.SilkS) (width 0.15)) (fp_line (start -1.625 1.625) (end -1.125 1.625) (layer F.SilkS) (width 0.15)) (fp_line (start 1.625 1.625) (end 1.125 1.625) (layer F.SilkS) (width 0.15)) (fp_line (start 1.625 -1.625) (end 1.125 -1.625) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -1.448 -0.75) (size 0.813 0.305) (layers F.Cu F.Paste F.Mask)) (pad 2 smd rect (at -1.448 -0.25) (size 0.813 0.305) (layers F.Cu F.Paste F.Mask)) (pad 3 smd rect (at -1.448 0.25) (size 0.813 0.305) (layers F.Cu F.Paste F.Mask)) (pad 4 smd rect (at -1.448 0.75) (size 0.813 0.305) (layers F.Cu F.Paste F.Mask)) (pad 5 smd rect (at -0.75 1.448) (size 0.305 0.813) (layers F.Cu F.Paste F.Mask)) (pad 6 smd rect (at -0.25 1.448) (size 0.305 0.813) (layers F.Cu F.Paste F.Mask)) (pad 7 smd rect (at 0.25 1.448) (size 0.305 0.813) (layers F.Cu F.Paste F.Mask)) (pad 8 smd rect (at 0.75 1.448) (size 0.305 0.813) (layers F.Cu F.Paste F.Mask)) (pad 9 smd rect (at 1.448 0.75) (size 0.813 0.305) (layers F.Cu F.Paste F.Mask)) (pad 10 smd rect (at 1.448 0.25) (size 0.813 0.305) (layers F.Cu F.Paste F.Mask)) (pad 11 smd rect (at 1.448 -0.25) (size 0.813 0.305) (layers F.Cu F.Paste F.Mask)) (pad 12 smd rect (at 1.448 -0.75) (size 0.813 0.305) (layers F.Cu F.Paste F.Mask)) (pad 13 smd rect (at 0.75 -1.448) (size 0.305 0.813) (layers F.Cu F.Paste F.Mask)) (pad 14 smd rect (at 0.25 -1.448) (size 0.305 0.813) (layers F.Cu F.Paste F.Mask)) (pad 15 smd rect (at -0.25 -1.448) (size 0.305 0.813) (layers F.Cu F.Paste F.Mask)) (pad 16 smd rect (at -0.75 -1.448) (size 0.305 0.813) (layers F.Cu F.Paste F.Mask)) (pad 17 smd rect (at 0 0) (size 1.854 1.854) (layers F.Cu F.Mask)) (pad "" smd rect (at 0.45 0.45) (size 0.7 0.7) (layers F.Paste)) (pad "" smd rect (at 0.45 -0.45) (size 0.7 0.7) (layers F.Paste)) (pad "" smd rect (at -0.45 0.45) (size 0.7 0.7) (layers F.Paste)) (pad "" smd rect (at -0.45 -0.45) (size 0.7 0.7) (layers F.Paste)) (model ${KISYS3DMOD}/Housings_CSP.3dshapes/LFCSP-16-1EP_3x3mm_Pitch0.5mm.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) )