(footprint "TestPoint_THTPad_D2.0mm_Drill1.0mm" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5A0F774F)
  (descr "THT pad as test Point, diameter 2.0mm, hole diameter 1.0mm")
  (tags "test point THT pad")
  (attr exclude_from_pos_files exclude_from_bom)
  (fp_text reference "REF**" (at 0 -1.998) (layer "F.SilkS")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 8975eb03-962d-48e7-8695-d3b9e38e5e36)
  )
  (fp_text value "TestPoint_THTPad_D2.0mm_Drill1.0mm" (at 0 2.05) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp d1697e01-4b44-4004-b433-ad9d39cb3729)
  )
  (fp_text user "${REFERENCE}" (at 0 -2) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 3b9a24ad-d8a8-4e1e-9972-62113e3ec411)
  )
  (fp_circle (center 0 0) (end 0 1.2) (layer "F.SilkS") (width 0.12) (fill none) (tstamp f868402b-31bd-4a1a-ab70-f66e091ead96))
  (fp_circle (center 0 0) (end 1.5 0) (layer "F.CrtYd") (width 0.05) (fill none) (tstamp fb6ad98f-13d7-4593-b78e-e2e5a7be4774))
  (pad "1" thru_hole circle (at 0 0) (size 2 2) (drill 1) (layers *.Cu *.Mask) (tstamp 89e425b7-7ac9-4512-ba98-94aa32b4624a))
)