(footprint "TestPoint_Pad_D3.0mm" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5A0F774F)
  (descr "SMD pad as test Point, diameter 3.0mm")
  (tags "test point SMD pad")
  (attr exclude_from_pos_files exclude_from_bom)
  (fp_text reference "REF**" (at 0 -2.398) (layer "F.SilkS")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp b79d59a7-b901-44ba-89a1-5137fdd7aa78)
  )
  (fp_text value "TestPoint_Pad_D3.0mm" (at 0 2.55) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp baf12a02-ae55-4148-9c77-5c4c6a28a0e1)
  )
  (fp_text user "${REFERENCE}" (at 0 -2.4) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 9ec646b2-3ebb-44ef-894f-0f1872e99829)
  )
  (fp_circle (center 0 0) (end 0 1.75) (layer "F.SilkS") (width 0.12) (fill none) (tstamp 31f798a7-15dd-40ba-9b02-09163f2ca9b6))
  (fp_circle (center 0 0) (end 2 0) (layer "F.CrtYd") (width 0.05) (fill none) (tstamp 98abf174-b948-4ab4-bf79-af83a87d9939))
  (pad "1" smd circle (at 0 0) (size 3 3) (layers "F.Cu" "F.Mask") (tstamp 574d0af7-7c3d-487a-b8a3-151bbe335c9b))
)