(footprint "PowerIntegrations_SMD-8C" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5A422B78)
  (descr "PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf")
  (tags "SMD DIP DIL PDIP SMDIP 2.54mm 7.62mm 300mil")
  (attr smd)
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  (model "${KICAD6_3DMODEL_DIR}/Package_DIP.3dshapes/PowerIntegrations_SMD-8C.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)