(footprint "Xilinx_RF1156" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5CDADFAA)
  (descr "Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition Appendix A")
  (tags "BGA 1156 1 RF1156")
  (solder_mask_margin 0.05)
  (attr smd)
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp ad79ae31-183a-4a5a-b8a4-332dcf8a5cd2)
  )
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp f25b6a49-f5bc-4b5d-a6ad-797b8b57d8b7)
  )
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 67ea9657-ab36-4744-86d0-d8a3eb8cf941)
  )
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  (model "${KICAD6_3DMODEL_DIR}/Package_BGA.3dshapes/Xilinx_RF1156.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)